- Overview
- Features
- Specifications
- Ordering Information
Overview
The XPand3200 redefines the limits of power, performance, and functionality in a sub-½ ATR system. This conduction-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving and performance-enhancing technology. In today's avionics and ruggedized environments, size really does matter, and the XPand3200 sets a new standard for sub-½ ATR computing. Depending on your processing requirements, the XPand3200 can be populated with high-performance, low-power 3U VPX or cPCI modules designed and manufactured by X-ES. X-ES also has an extensive lineup of XMC and PMC solutions to fulfil your data-processing and I/O requirements. Additionally, X-ES provides integration services for third party modules. An optional SATA SSD memory module provides the convenience of removable storage and the ruggedness of solid-state memory at up to 64 GB. An optional front-panel USB port provides system monitoring and maintenance capabilities. X-ES maximizes power supply performance, supporting up to 200 W from a MIL-STD-704 28V DC or 115V AC input. Internal EMI filtering and hold up for up to 60-ms at 200 W are also provided.
Features
½ ATR compliant, conduction-cooled chassis (reduced height and length) Physical dimensions of 4.88 in. (W), 5.62 in. (H), 8.75 in. (L) 3U VPX and cPCI backplanes available Optional front-panel USB port Optional SATA SSD memory module with easy removal and insertion Optional PCI Express fabric backplane Optional Gigabit Ethernet switched backplane Configurable rear panel I/O connectors Integration services with third-party modules available Up to 200 W from a MIL-STD-704 28V DC or 115V AC source MIL-STD-461 E/F EMI filtering Environmentally sealed Internal holdup of up to 60 ms at 200 W
Specifications
Physical Characteristics ½ ATR-compliant, conduction-cooled chassis (reduced height and length) 4.88 in. (W), 5.62 in. (H), 8.75 in. (L) Backplane Options 3U VPX 3U cPCI Custom backplane solutions available Front Panel I/O Options USB 2.0- and 1.0-compliant interface Three user-defined push buttons Removable SATA SSD storage media bay with high-reliability connector Custom front panel I/O Back Panel I/O Options Up to three D38999 circular connectors for I/O DVI graphics interfaces USB 2.0- and 1.0-compliant interfaces 10/100/1000BASE-T Gigabit Ethernet interfaces RS-232/RS-422 serial links MIL-STD-1553 ARINC-429 Custom I/O via XMC/PMC modules Custom I/O via third party modules Power Supply Options MIL-STD-704 28V DC input voltage support (default) MIL-STD-704 115-AC input voltage support Up to 60 ms internal hold-up time at 200 W Up to 110 ms internal hold-up time at 120 W Additional power supply options available
Ordering Information
Contact Sarsen Technology
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Orderline: +44 1672 511166
Manufacturer
Extreme Engineering Solutions
Model No
XPand3200
Bottom Panel Brands
About Sarsen Technology
Sarsen Technology is a franchised distributor for BittWare, Conduant, Danville Signal Processing, Extreme Engineering Solutions (X-ES), General Standards, Tech Source, Trenton Systems, Trenton Technology, United Electronic Industries (UEI) and VersaLogic. We provide full local technical and commercial support for our clients and celebrated ten successful years in 2010.