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XCalibur5090


Overview

Dual Virtex-7 Based Digital Signal Processing 6U LRM FPGA with Quad 2500 MSPS DAC and 3200 MSPS ADC

The XCalibur5090 from Extreme Engineering is a high-performance, reconfigurable, conduction-cooled 6U LRM module based on the Xilinx Virtex-7 family of FPGAs. With a pair of Virtex-7 FPGA, high-speed serial interfaces, DAC and ADC channels, external memory, and flexible, high-density I/O, the XCalibur5090 is ideal for customisable, high-bandwidth, signal-processing applications.

The XCalibur5090 utilises four AD9739 and two ADC12D1600RF to provide four channels of high-frequency 14-bit Digital Analog Conversion (DAC) at 2500 Mbps and four channels of 12-bit Analog Digital Conversion (ADC) at 3200 Mbps for high-performance Digital Signal Processing (DSP).

The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded streaming data applications and simplify FPGA development. It includes IP blocks, example FPGA designs, and software to control and communicate with FPGAs.

Technical

  • Two Xilinx Virtex-7 XC7VX690T FPGAs
  • Up to 1 GB of DDR3 SDRAM per FPGA in two channels
  • Non-volatile FPGA configuration flash
  • 128 MB of user NOR flash per FPGA
  • Conduction-cooled 6U LRM form factor
  • Four 14-bit 2500 MSPS AD9739 DAC
  • Two dual-channel 12-bit 3200 MSPS ADC12D1600RF ADC
  • 234 single-ended FPGA interconnects
  • Eight high-speed serial FPGA interconnects
  • 28 FPGA GPO to the backplane
  • 51 FPGA GPI from the backplane
  • 17 FPGA GPIO to the backplane
  • FPGA Development Kit (FDK)

Specifications

FPGA

  • Dual Xilinx Virtex-7 for high-performance logic and DSP applications
  • Up to 1 GB of DDR3-1600 SDRAM per FPGA in two channels
  • 128 MB of user NOR flash per FPGA
  • x8 GTX interconnect between FPGAs
  • 234 single-ended interconnect between FPGA


Supported FPGAs

  • Xilinx Virtex-7 XC7VX690T
  • Support for commercial and industrial temperature as well as -1, -2, -3 speed grades


Development Support


LRM Backplane I/O

  • x1 GTX
  • 28 3.3 V CMOS from FPGA
  • 51 3.3 V CMOS to FPGA
  • 17 3.3 V CMOS GPIO to FPGA
  • x1 RF REFCLK input
  • x4 RF ADC inputs
  • x4 RF DAC outputs


Additional Features

  • Debug access connector
  • Debug LEDs
  • JTAG
  • x10 1.8 V GPIO to FPGA


Physical Characteristics

  • 6U LRM conduction-cooled form factor
  • Dimensions: 233 mm x 164 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 in. and 1.0 in. pitch with solder-side cover


Environmental Requirements

  • Supported ruggedisation levels (see the X-ES Ruggedization Chart): 1, 3, 5
  • Conformal coating available as an ordering option


Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Technical documents

Ordering information

There are a number of different options available. Please contact Sarsen Technology for appropriate board configurations based on environmental requirements.

Software

Associated products