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XPedite7674


Overview

Intel® Xeon® D Processor-Based 3U VPX-REDI Single Board Computer (SBC) with Dual 10GbE and Xilinx Kintex® Ultrascale™ FPGA

The XPedite7674 from Extreme Engineering Solutions (X-ES) is a high-performance, 3U VPX-REDI single board computer based on the Xeon® D processor from Intel. The  Xeon® D processor can provide up to 16 Xeon®-class cores in a single, power-efficient System-on-Chip (SoC) package, with native extended temperature support for up to 12 core-count SKUs. Coupled with the Xilinx Kintex® UltraScale™ FPGA, the XPedite7674 delivers enhanced performance and efficiency for today’s embedded computing applications

The XPedite7674 provides secure network interfaces by providing one 1000BASE-X Gigabit Ethernet interface from the FPGA and passing two CPU 10 Gigabit 10GBASE-KR Ethernet interfaces through the FPGA. It accommodates up to 16 GB of DDR4-2133 ECC SDRAM in two channels and up to 32 GB of onboard SATA NAND flash in addition to numerous I/O ports, including USB, SATA, and RS-232/422/485 serial through the backplane connectors.

Technical

  • Supports Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
  • Up to 16 Xeon®-class cores in a single, power-efficient SoC package
  • 4, 8, or 12 core SKUs available with native extended temperature support
  • Xilinx Kintex® UltraScale™ XCKU060 or XCKU095 FPGA with up to 8 GB DDR4-2133 ECC SDRAM and 1 Gb synchronous configuration BPI flash
  • 3U VPX (VITA 46) module
  • Compatible with multiple VITA 65 OpenVPX™ slot profiles
  • Rugged Enhanced Design Implementation (REDI) per VITA 48
  • Up to 16 GB of DDR4-2133 ECC SDRAM in two channels
  • Up to 32 GB of SLC NAND flash
  • XMC site with a x8 PCIe interface and rear I/O support
  • Two x4 PCI Express backplane fabric interconnects
  • Two 10 Gigabit Ethernet ports and one 1000BASE-X Ethernet port
  • One SATA port and two USB 2.0 ports
  • Support for DeepCover Security Manager secure supervisor (optional)
  • coreboot firmware powered by Intel® FSP
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Specifications

Processor
    Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
    Up to 16 Xeon®-class cores in a single, power-efficient SoC package
    4, 8, or 12 core SKUs available with native extended temperature support

Memory
    Up to 16 GB of DDR4-2133 ECC SDRAM in two channels
    Up to 32 GB of SLC NAND flash
    32 MB NOR boot flash
    64 kB EEPROM

FPGA
    Xilinx Kintex® Ultrascale™ XCKU060 or XCKU095 FPGA
    1 Gb synchronous configuration BPI flash
    Up to 8 GB of DDR4-2133 ECC SDRAM
    Two x4 PCI Express Gen3-capable interfaces
    One x4 PCI Express Gen2-capable interface
    Support for DeepCover Security Manager secure supervisor (optional)

XMC Site
    x8 PCI Express Gen3-capable port
    One SATA port

VPX (VITA 46) P0 I/O
    One IPMB port
    VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)

VPX (VITA 46) P1 I/O
    x4 PCI Express Gen3-capable interface to P1.A
    x4 PCI Express Gen3-capable interface to P1.B
    Two 10GBASE-KR Ethernet ports from FPGA (optional)
    XMC P16 I/O, mapping P1w9-X12d per VITA 46.9

VPX (VITA 46) P2 I/O
    One SATA port capable of 6 Gb/s
    Two USB 2.0 ports
    Four RS-232/422/485 serial ports
    One 1000BASE-X Ethernet port from FPGA (optional)
    Four High-Speed Serial ports from FPGA
    GPIO from FPGA

Software Support
    coreboot firmware powered by Intel® FSP
    Wind River VxWorks BSP
    X-ES Enterprise Linux (XEL) BSP
    Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Physical Characteristics
    3U VPX-REDI conduction- or air-cooled form factor
    Dimensions: 100 mm x 160 mm
    0.8 in. pitch without solder-side cover
    1.0 in. pitch with Two-Level Maintenance (2LM) support (optional)

Environmental Requirements
Contact Sarsen Technology for appropriate board configuration based on environmental requirements.

    Supported ruggedisation levels (see the X-ES Ruggedization Chart): 1, 3, 5
    Conformal coating available as an ordering option
    Thermal performance will vary based on CPU frequency and application

Power Requirements
    Power will vary based on configuration and usage. Please consult factory.

 

Technical documents

Ordering information

Please contact Sarsen Technology to discuss your requirements and to request a quote.

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