TQ9 PICMG 1.3® Single Board Computer / System Host Board with Multi-Core Intel® Core 2 Processor

The Trenton Technology TQ9 is a graphics-class System Host Board (SHB) with on-board audio, a dual-core or quad-core processor option, up to 8GB of system memory, built-in RAID support and many other advanced I/O capabilities. Direct support for x16, x8, x4 and x1PCI Express™ links to a PICMG® 1.3 backplane as well as a 32-bit/33MHz PCI interface are featured on the Trenton TQ9 single board computer.

Processor

• Intel® Core™ 2 Processor - E8xxx, Q9xxx series
• Intel® Core™ 2 Duo Processor - E4xxx, E6xxx series
• Intel® Pentium® Dual Core Processor - E2xxx series
• Intel® Celeron® Processor - 4xx series
• Processor Package: LGA775 socket

Chipset

The Intel® Q35 Express Chipset provides an advanced internal video and graphics port along with a separate x16 PCI Express interface. A dual-channel DDR2-800 memory interface supports four DIMM sockets and up to 8GB of system memory. The TQ9's ICH9DO also provides x1 and x4 PCI Express interfaces plus a 32-bit/33MHz PCI interface. Analog and digital audio capability is built into the Trenton TQ9 via the ICH9DO.

Key Features:

• SBC that supports a wide variety of multi-core Intel® processors including the long-life/embedded Dual-Core Intel® Core™ 2 Processor E8400 (pending) and the Intel® Core™ 2 Duo Processor E6400 or E4300
• Intel® Q35 Express chipset and the ICH9DO with built-in SATA RAID support
• Quad-core processor options supported including the Intel® Core™ 2 Processor Q9550
• PCI Express™ graphics-class SHB supports x16 video and graphics cards or ADD2 cards
• Direct connect video option via the chipset's Intel® Graphics Media Accelerator 3100
• Supports dual channel DDR2-800 memory, 8GB maximum
• Audio Codec interface and analog audio port
• Eight USB and four SATA/300 (i.e. SATA II 300) on-board ports
• Integrated RAID 0,1,5 and 10 implementation support via four on-board SATA/300 ports
• Two eSATA II and four USB backplane interfaces
• Dual Gigabit Ethernet ports plus one 10/100Base-T backplane interface

Ethernet Interfaces

The TQ9 uses an internal x1 PCI Express link to connect the I/O Controller hub to the dual-port Gigabit Ethernet controller chip. This design feature enables dual 10/100/1000Base-T Ethernet interfaces on LAN 1 and LAN2. The LAN ports have RJ-45 connectors on the I/O bracket to provide the mechanical interfaces to the Ethernet networks.

PICMG® 1.3 Backplane I/O Interfaces

The TQ9 enables the following PICMG 1.3 backplane I/O connectivity via the SBC’s edge connector C:

• Four USB ports
• Two eSATA interfaces
• One 10/100Base-T Ethernet interface

Four Serial ATA/300 (i.e. SATA II 300) Ports

The primary and secondary Serial ATA (SATA) II ports on the TQ9 board support four independent SATA storage devices such as hard disks, DVD-RW and CD-RW devices. SATA produces higher performance interfacing by providing data transfer rates up to 300MB per second on each port. The TQ9's ICH9DO I/O Controller hub features Intel® Matrix Storage Technology, which allows the ICH9DO's SATA controller to be configured as a RAID controller supporting RAID 0, 1, 5, and 10 implementations.

Twelve USB Interfaces

A total of twelve USB 2.0 interfaces are supported by the TQ9. USB ports 0 and 1 are on the I/O bracket and ports 2, 3, 4, 5, 6 and 7 have header connectors on the TQ9. USB interfaces 8,9,10 and 11 are routed directly to the TQ9's edge connector C for use on a PICMG® 1.3 backplane.

DDR2-800 Memory

The DDR2-800 interface is a dual-channel interface originating at the Memory Controller Hub, with each channel terminating at two DIMM module sockets. The TQ9 supports system memory transfer rates of 800MHz using unbuffered, non-ECC PC2-6400 DIMMs. The TQ9's four DIMM sockets support a maximum memory capacity of 8GB. When using a single PC2-6400 DIMM, the peak memory interface bandwidth is 6.4GB/s, and placing a PC2-6400 DIMM in each socket of the two memory channels produces a TQ9 theoretical peak memory bandwidth of 12.8GB/s.

NOTE: All memory modules must have gold contacts.

Cache Memory (L2)

The quad-core Intel® Core™ 2 Q9xxx series processors feature a level two (L2) cache memory capacity of 12MB (2x6MB). The dual-core Intel® Core™ 2 E8xxx series of processors support an L2 cache memory size of 6MB. The dual-core Intel® Core™ 2 Duo Processor (E6xxx and E4xxx series) feature 2MB L2 cache memories while the Intel® Pentium® Dual Core Processor - E2xxx series CPUs support an L2 cache of 1MB. The single-core Intel® Celeron® 4xx processors feature a 516KB level two (L2) cache memory.

Memory DIMM Slot Population

Trenton's TQ9 supports two types of memory operations:

Interleaved Mode - This is the mode of operation that enables the highest memory interface speed and bandwidth throughput capability. Often times this mode of operation is referred to as "dual-channel mode". Interleaved mode occurs when using two or four DIMM modules with equal memory capacities. The DIMM technology and device width can vary but the installed memory capacity for each channel must be equal. If different speed DIMMs are used in each channel then the slowest DIMM will determine the memory interface speed.

Asymmetric Mode - From a system operational standpoint, asymmetric mode functions as a "single-channel" memory interface. Asymmetric mode occurs when using either a single DIMM module or DIMM modules with unequal memory capacities The DIMM technology and device width can vary in each channel and if different speed DIMMs are used in each channel then the slowest DIMM will determine the memory interface speed.

A memory module can be installed in only one DIMM socket. If only one DIMM module is used, it must be populated in either DIMM socket BKA1 or BKB1.

The TQ9's memory interface operates at maximum bandwidth with two DIMMs of the same size installed in DIMM Socket BKA1 and BKB1, but the DIMMs may differ in technology (component density) and/or device width. Populating identical DIMMs in all four DIMM sockets will also achieve maximum memory bandwidth operation. To ensure maximum system performance and reliability, Trenton Technology recommends using DIMMs that support the Serial Presence Detect (SPD) data structure.

NOTE 1: Double-sided DIMMS with a x16 organization are not supported.

NOTE 2: To minimize memory channel errors regardless of the type of memory module used; Trenton Technology recommends memory DIMMs with a memory clock cycle specification of ten (10).

PCI Express Interfaces

Trenton Technology's TQ9 graphics-class single board computer or system host board provides one x16 PCI Express link on the SBC's edge connectors A and B. A x4 PCI Express link and five PCI Express reference clocks are also included on edge connectors A and B. An additional x1 PCI Express link and reference clock between the TQ9 and backplane can be provided by Trenton's optional IOB3x I/O Expansion Module. The PCI Express links are used on SHB Express backplanes to support PCI Express option cards and the bridge chips that provide PCI/PCI-X option card support. During system initialization the TQ9 automatically negotiates with the PCI Express cards connected to the PCI Express links in order to set up communication between the devices. The net result is that the TQ9 system host board supports communication to x1, x4, x8 and x16 PCI Express boards as well as PCI/PCI-X cards via PCI Express-to-PCI/PCI-X bridge chip technology. The TQ9 also provides a 32-bit/33MHz PCI bus interface on edge connector D.

PCI Express Configuartion and Speed

• PCI Express - Edge Connector A & B - One x16 link, one x4 or four x1 links - Five reference clocks
• PCI Express - (via optional IOB31) - One x1 link and ref. clock
• PCI - Edge Connector D - 32-bit/33MHz System or FSB - 1333MHz, 1066MHz or 800MHz

Notes:

1. The x16 link may be used for external PCI Express video cards or to support general purpose PCI Express cards in conjunction with the TQ9’s internal video port.

2. The x16 PCIe link on SHB edge connectors A & B can not be bifurcated into multiple PCIe links on a PICMG 1.3 backplane.

3. The x4 PCIe link on SHB edge connectors A & B may be divided into four x1 PCIe links on a PICMG 1.3 backplane.

Video Interfaces

The TQ9 supports three video connection options:

• Direct connection via the chipset's Intel® Graphics Media Accelerator 3100 with faster graphics and 3D performance
• An external video card installed in a backplane's x16 PCI Express slot will use the TQ9's x16 PCIe link that provides 3.5 times more bandwidth than an AGP 8X interface
• ADD2 video and graphic cards

Audio Interfaces

The TQ9 supports two Audio interface connections:

• Intel® High Definition Audio - This digital audio interface can be used to attach different types of codecs; such as audio and modem codecs to connector P40 of the TQ9. This audio link operates 3.3 V and supports multi-channel audio streams, a 32-bit sample depth, and an audio sample rate up to 192 kHz.
• Analog Audio - The TQ9’s analog audio connector (P9) supports microphone input and HP-out audio functions.

Bios (Flash)

The TQ9 uses AMIBIOS8®. The flash BIOS resides in the Firmware Hub (FWH). AMIBIOS8 contains features such as:

• Support for flash devices for BIOS upgrading
• Integrated support for USB mass storage devices such as USB CD-ROM, CD-RW, etc.
• Boot from network, USB mass storage devices, IDE or ATAPI
• Serial port console redirection to support headless operation (requires optional IOB30 or IOB31)
• SATA/ATA/ATAPI support includes 48-bit LBA addressing to support SATA/ATA/IDE hard drive c apacities over 137GB

IOB30 / IOB31 I/O Expansion Board

This optional board provides legacy I/O connections via the Super I/O controller (LPC47B272). The Trenton IOB30’s I/O controller connects to the TQ9’s LPC Bus via the board’s controlled impedance connector. Please visit the followwing page for more details:

Power Requirements

Typical values - CPU Idle State

Typical Values - 100% CPU Stress State

-12V @ <100mA

Tolerance for all voltages is +/- 5% and must be applied by the PICMG 1.3 backplane to edge connector C. All processors listed are dual core CPUs except: (#) quad-core [Yorkfield] Intel® Core 2™ and (*) single-core Intel® Celeron®.

Ordering Information

* Please call Sarsen Technology on +44 1672 511166 for latest processor speed availability information. The stated bus speed, memory and communication interface speeds are component maximums; actual system performance may vary.

For further details of this Intel Quad-Core, Dual-Core and Single-Core PCI Express Single Board Computer and other PICMG 1.3 Trenton Technology products, please see the Trenton Technology web pages on this site or contact us via our Contacts page.