Extreme Engineering Solutions Inc.

XPedite5370

Freescale Dual-Core MPC8572E PowerQUICC™ III Processor-Based Conduction- or Air-Cooled VPX-REDI Module

The Extreme Engineering Solutions XPedite5370 is a high-performance 3U VPX-REDI single-board computer based on the Freescale MPC8572E PowerQUICC III processor. With dual PowerPC e500 cores running at up to 1.5 GHz, the MPC8572E delivers enhanced performance and efficiency for today's embedded computing applications.

PCI Express / Serial RapidIO

The XPedite5370 supports two separate channels of up to 2 GB each of up to DDR2-800 ECC SDRAM, as well as up to 4 GB of NAND flash and up to 256 MB of NOR flash (with redundancy). The XPedite5370 provides the option of utilizing a PCI Express or Serial RapidIO Fat Pipe P1 interconnect, as well as two SERDES Gigabit Ethernet Thin Pipe P1 fabric interconnects. The XPedite5370 also supports dual Gigabit Ethernet, GPIO, I²C, PMC I/O, XMC I/O, and up to two RS-232/RS-422/RS-485 serial ports through the P2 connector.

Software Support

The XPedite5370 provides a ruggedized, high-performance, feature-rich solution to support the next generation of rugged embedded applications. Wind River VxWorks, QNX Neutrino, and Green Hills INTEGRITY Board Support Packages (BSPs) are available, as well as a Linux 2.6 LSP.

PROCESSOR

• Freescale MPC8572E PowerQUICC III processor
• Dual PowerPC e500 cores at up to 1.5 GHz
• 1 MB of shared L2 cache

MEMORY

• Two channels of up to DDR2-800 ECC SDRAM, up to 4 GB (2 GB each)
• Up to 256 MB of NOR flash (with redundancy)
• Up to 4 GB of NAND flash

VPX (VITA 46) P1 I/O

• x4 PCI Express or Serial RapidIO to P1.A
• x4 PCI Express to P1.B
• Two SERDES Gigabit Ethernet ports (or one 10/100/1000BASE-T port out P1 and one 10/100/1000BASE-T port out P2)
• X12d XMC P16 I/O

VPX (VITA 46) P2 I/O

• One 10/100/1000BASE-T port (when two SERDES Gigabit Ethernet P1 ports are not used)
• Up to two RS-232/RS-422/RS-485 serial ports
• I²C port
• 3.3V GPIO signals
• P64s PMC P14 I/O

PrPMC/XMC SITE

• 32-bit, 66-MHz PCI bus (PMC interface)
• x4 PCIe port (XMC interface)
• P64s P14 I/O support
• X12d P16 I/O support

FRONT PANEL I/O

• Front-panel RJ45 Ethernet and mini-DB9 RS-232 serial ports available via optional plugover module

SOFTWARE SUPPORT

• Linux LSP
• Wind River VxWorks BSP
• QNX Neutrino BSP
• Green Hills INTEGRITY BSP
• Windows drivers

PHYSICAL CHARACTERISTICS

• 3U VPX-REDI conduction- or air-cooled form factor
• Dimensions: 100 mm x 160 mm
• 0.8-in. pitch without solder side cover
• 0.85 and 1.0-in. pitch with solder side cover

ENVIRONMENTAL REQUIREMENTS

• Air-cooled operating temperature: -40 to 70 ºC (ambient, with 200-LFM airflow)
• Conduction-cooled operating temperature: -40 to 85 ºC (at thermal interface)
• Humidity: 0% to 95% non-condensing
• Storage temperature: -55 to 105 ºC

RUGGEDIZATION

• Air-cooled: VITA 47 Class V1 vibration, Class OS1 shock
• Conduction-cooled: VITA 47 Class V3 vibration, Class OS2 shock

POWER REQUIREMENTS

• Maximum power consumption: 35 W (with 1.5-GHz processor), 27 W (with 1.2-GHz processor)

Please contact Sarsen Technology on +44 1672 511166 for technical support, pricing and lead time information on the XPedite5370 VPX-REDI 3U module or the full range of Extreme Engineering Solutions Freescale Semiconductor embedded products.