Processor
- Intel® Xeon® D (formerly Broadwell-DE)
- Up to eight Xeon®-class cores in a single, power-efficient SoC package
Memory
- Up to 16 GB of DDR4-2133 ECC SDRAM in two channels
- Up to 32 GB of SLC NAND flash
- 32 MB NOR boot flash
- 64 kB EEPROM
XMC Site
- x8 PCI Express Gen3-capable port
- One SATA port
- Six SmartFusion®2 GPIO
Security and Management
- SmartFusion®2 security FPGA with 1 GB DDR3-667 ECC SDRAM and 32 MB SPI flash
- SmartFusion®2 zeroization
- System voltage monitor, power-on/reset control, non-volatile write-protection control
- Non-Deterministic Random Number Generator, Encryption
- Environmental sensors (
see product manual)
- Trusted Platform Module (TPM) 1.2 or 2.0
VPX (VITA 46) P0 I/O
- Two SmartFusion®2 I²C ports
VPX (VITA 46) P1 I/O
- x4 PCI Express Gen3-capable interface to P1.A
- x4 PCI Express Gen3-capable interface to P1.B
- Two 10GBASE-KR Ethernet ports
- XMC P16 I/O, mapping P1w9-X12d per VITA 46.9
VPX (VITA 46) P2 I/O
- Two 10/100/1000BASE-T Gigabit Ethernet ports
- Four SATA ports capable of 6 Gb/s
- Two USB 2.0 ports
- Four RS-232/422/485 serial ports
- Single-ended and differential GPIO from SmartFusion®2
Software Support
-
coreboot firmware powered by Intel® FSP
-
Wind River VxWorks BSP
-
X-ES Enterprise Linux (XEL) BSP
- Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- Dimensions: 100 mm x 160 mm
- 0.8 in. pitch without solder-side cover
- 1.0 in. pitch with Two-Level Maintenance (2LM) support (optional)