Products

XPedite2770

Overview

AMD Versal® Prime VM1402 ACAP-Based 3U VPX FPGA Module

The XPedite2770 from Extreme Engineering Solutions, is a high-performance, reconfigurable, conduction-cooled, 3U VPX processing module based on the AMD (formerly Xilinx) Versal® Prime Adaptive Compute Acceleration Platform (ACAP).

With multiple high-speed fabric interfaces and 16 GB of LPDDR4 ECC SDRAM in two channels, the XPedite2770 is ideal for customizable, high-bandwidth, signal-processing applications. It integrates SecureCOTS™ technology with a Versal® Prime VM1402 ACAP for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.

Technical

AMD (formerly Xilinx) Versal® Prime VM1402 ACAP
3U VPX (VITA 46) module
Compatible with multiple VITA 65 OpenVPX™ slot profiles and SOSA-aligned options
16 GB of LPDDR4 ECC SDRAM in two channels
4 Gbit of QSPI FPGA configuration flash
32 GB of SLC NAND flash
XMC site with one x8 PCI Express interface and rear I/O support
Two 10/100/1000BASE-T Ethernet ports
Two GTY High-Speed Serial (HSS) lanes capable of 10GBASE-R Ethernet (contact X-ES for IP requirements)
Two x4 PCI Express Gen3 interfaces to P1.A and P1.B
One x1 PCI Express Gen3 interface
One RS-232/422/485 serial port
One UART/RS-232 maintenance port
14 LVDS GPIO
16 single-ended (SE) GPIO
Linux Yocto support
FPGA Development Kit (FDK)

Specifications

FPGA

AMD (formerly Xilinx) Versal® Prime VM1402 ACAP for high-performance logic and DSP applications
Dual-core ARM® Cortex®-A72, 48 KB/32 KB L1 cache with parity and ECC; 1 MB L2 cache with ECC
Dual-core ARM® Cortex®-R5F, 32 KB/32 KB L1 cache, and 256 KB TCM with ECC

Memory

16 GB of LPDDR4 ECC SDRAM in two channels
32 GB of SLC EMMC NAND flash
4 Gbit of QSPI FPGA configuration flash

VPX (VITA 46) P0 I/O

Two IPMB connections to an IPMI controller

VPX (VITA 46) P1 I/O

Two x4 PCI Express Gen3-capable interfaces to P1.A and P1.B
Two GTY High-Speed Serial (HSS) lanes capable of 10GBASE-R Ethernet (contact X-ES for IP requirements)
XMC P16 I/O, mapping P1w9-X12d per VITA 46.9

VPX (VITA 46) P2 I/O

Two 10/100/1000BASE-T Ethernet ports
Six LVDS GPIO
One x1 PCI Express Gen3-capable interface (contact X-ES for SATA support options)
One RS-232/422/485 serial port
Build option for eight LVDS and 16 SE GPIO from the FPGA, or XMC P16 I/O mapping P2w9-X16s+X8d

XMC Site

One x8 PCI Express Gen3-capable interface

Development Support

U-Boot firmware
Linux Yocto support

Physical Characteristics

3U VPX-REDI conduction- or air-cooled form factor
Dimensions: 100 mm x 160 mm
0.8 in. pitch without solder-side cover
0.85 in. and 1.0 in. pitch with solder-side cover and Two-Level Maintenance (2LM) support

Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.

Supported ruggedization levels
Conformal coating available as an ordering option

Power Requirements

Power will vary based on configuration and usage. Please consult factory.

Technical documents

XPedite2770 Datasheet

Ordering information

There are a range of options available. Please contact Sarsen to discuss your project requirements.

Boards

Systems

Accessories

Format

Processor