• Supports Intel® Xeon® D-1700 series (formerly Ice Lake-D) processors
• Up to 10 Xeon®-class cores in a single, power-efficient SoC package
• SKUs available with native extended temperature support
• Designed with SecureCOTS™ technology to support enhanced security and trusted computing
• Microsemi® PolarFire™ FPGA with 128 MB SPI flash
• 6U CompactPCI module
• Complies with PICMG 2.0, 2.3, 2.9, 2.16
• Air cooling
• 48 GB of DDR4 ECC SDRAM in three channels
• 32 GB of SLC NAND flash
• One XMC/PMC site with x8 PCIe Gen3 interface and rear I/O support
• Seven 10/100/1000BASE-T Ethernet ports
• Three USB 2.0 ports
• Two RS-232/422/485 serial ports
• Wind River VxWorks BSP
• X-ES Enterprise Linux (XEL) BSP
• Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Processor

• Intel® Xeon® D-1700 series (formerly Ice Lake-D) processors
• Up to 10 Xeon®-class cores in a single, power-efficient SoC package
• SKUs available with native extended temperature support

Memory

• 48 GB of DDR4 ECC SDRAM in three channels
• 32 GB of SLC NAND flash
• 64 MB NOR boot flash
• 64 kB EEPROM

Security and Management

• Microsemi® PolarFire™ FPGA with 128 MB SPI flash
• Designed with SecureCOTS™ technology to support enhanced security and trusted computing
• System voltage monitor, power-on/reset control, non-volatile write-protection control
• Trusted Platform Module (TPM)

cPCI

• PICMG 2.3 (PMC I/O to P3 and P5)
• PICMG 2.9 (dedicated IPMI controller)
• PICMG 2.16 (two 10/100/1000BASE-T Ethernet ports)

XMC (VITA 42.3)

• x8 PCI Express Gen3-capable

Front Panel I/O

• Five 10/100/1000BASE-T Ethernet ports
• One USB 2.0 port
• General-purpose LEDs
• Two SFP+ cages

Rear Panel I/O

• Two 10/100/1000BASE-T Ethernet ports
• Two USB 2.0 ports
• Two RS-232/422/485 serial ports
• 3.3 V GPIO signals
• PMC I/O

Additional Features

• Non-volatile memory write protection
• Optional Trusted Platform Module (TPM)
• IEEE 1588 support

Software Support

• UEFI firmware
• Wind River VxWorks BSP
• X-ES Enterprise Linux (XEL) BSP
• Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Window drivers

Physical Characteristics

• 6U CompactPCI air-cooled form factor
• Dimensions: 233 mm x 160 mm

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 1
• Conformal coating available as an ordering option
• Thermal performance will vary based on CPU frequency and application

Power Requirements

• Power will vary based on configuration and usage. Please consult factory.