Processor

• Intel® Xeon® D-2700 series (formerly Ice Lake-D) processor
• Up to 20 Xeon®-class cores in a single, power-efficient SoC package
• SKUs available with native extended temperature support

Memory

• 64 GB of DDR4 ECC SDRAM in four channels
• 32 GB of SLC NAND flash
• 64 MB NOR boot flash
• 64 kB EEPROM

Security and Management

• Microsemi® PolarFire™ FPGA with 128 MB SPI flash
• Designed with SecureCOTS™ technology to support enhanced security and trusted computing
• System voltage monitor, power-on/reset control, non-volatile write-protection control
• Trusted Platform Module (TPM)

VPX (VITA 46) P0 I/O

• Two IPMB connections to an IPMI Controller (IPMC)

VPX (VITA 46) P1 I/O

• Two 40GBASE-KR4 Ethernet ports to P1.A and P1.B
• Two general-purpose interrupts

VPX (VITA 46) P2 I/O

• One x16 PCI Express Gen3-capable interface

VPX (VITA 46) P3 I/O

• Build option for PMC P24 I/O per VITA 46.9 P64s, or XMC P26 I/O per VITA 46.9 X38s

VPX (VITA 46) P4 I/O

• XMC P26 I/O per VITA 46.9 x12d+x8d
• Two 10/100/1000BASE-T Ethernet ports
• Two 1000BASE-X Ethernet ports
• Eight single-ended FPGA GPIOs

VPX (VITA 46) P5 I/O

• Two RS-232/422/485 serial ports
• Build option for PMC P14 I/O per VITA 46.9 P64s, or XMC P16 I/O per VITA 46.9 X38s

VPX (VITA 46) P6 I/O

• XMC P16 I/O per VITA 46 x12d+x8d
• Two USB 2.0 ports
• One x4 PCI Express Gen2-capable interface

XMC

• x8 PCI Express Gen3-capable port to J15 and J25
• Pn6 I/O to VPX connectors per VITA 46.9 X8d+X12d
• Build option for Pn6 I/O to VPX connectors, per VITA 46.9 X38s

PrPMC

• Build option for Pn4 I/O to VPX connectors per VITA 46.9 P64s

Software Support

• UEFI firmware
• Wind River VxWorks BSP
• X-ES Enterprise Linux (XEL) BSP
• Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Physical Characteristics

• Contact factory for details

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
• Conformal coating available as an ordering option
• Thermal performance will vary based on CPU frequency and application
• Contact X-ES for air-cooled development options

Power Requirements

• Power will vary based on configuration and usage. Please consult factory.