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XCalibur4643


Overview

Intel Xeon D Processor-Based 6U VPX Module with Quad 10GbE, Dual XMC/PMC Sites, and Onboard Xilinx FPGA

The XCalibur4643 from Extreme Engineering is a rugged 6U VPX board featuring an Intel® Xeon® D (formerly Broadwell-DE) processor and a Xilinx Kintex UltraScale FPGA.

Ideal for systems requiring high-bandwidth processing and low power consumption, the XCalibur4643 provides up to 16 GB of DDR3-1600 ECC SDRAM in two channels, two XMC/PrPMC slots, and up to 128 GB of SATA NAND flash. Theboard also supports up to five Gigabit Ethernet ports, four SATA ports, three USB ports, and up to four RS-232/422/485 serial ports out the front panel and/or backplane.

Wind River VxWorks, X-ES Enterprise Linux (XEL), and Microsoft Windows 7 BSPs are available.

Technical

  • Supports Intel® Xeon® D processors (formerly Broadwell-DE)
  • Xilinx FPGA board - Kintex UltraScale XCKU040 FPGA
  • 6U OpenVPX™ (VITA 46) module
  • VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)
  • Compatible with multiple OpenVPX™ (VITA 65) profiles
  • Rugged VPX board - Ruggedised Enhanced Design Implementation (REDI) per VITA 48
  • Conduction or air cooling
  • Supports two XMC/PrPMC modules
  • Up to 16 GB of DDR3-1600 ECC SDRAM in two channels
  • Contact Sarsen for future availability of DDR4 SDRAM
  • Up to 128 GB of onboard SATA NAND flash
  • Four 10 Gigabit Ethernet ports and up to five Gigabit Ethernet ports
  • Three x4 PCI Express Gen3-capable ports from switch to backplane
  • Four SATA ports
  • Three USB ports (two of which are USB 3.0-capable)
  • Up to four RS-232/422/485 serial ports
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Microsoft Windows 7 BSP
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs

Specifications

Processor

  • Intel® Xeon® D (formerly Broadwell-DE)
  • Up to eight Xeon®-class cores in a single, power-efficient SoC package
 

Memory

  • Up to 16 GB of DDR3-1600 ECC SDRAM in two channels (available now)
  • Up to 32 GB of DDR4-2133 ECC SDRAM in two channels (available in Q1 2016 when industrial DDR4 is available)
  • Up to 128 GB of NAND flash
  • 32 MB NOR boot flash
  • 64 kB EEPROM
 

OpenVPX™

  • VITA 46.11 (System Management on VPX)
  • Compatible with multiple OpenVPX™ (VITA 65) profiles
  • Four 10 Gigabit Ethernet ports to P1
  • Three x4 PCI Express Gen3-capable ports to P2
  • Two 10/100/1000BASE-T Ethernet ports
  • XMC and PMC I/O to P3, P4, P5, P6, mapping P3w1P4-P64s+X12d+X8d
 

Front Panel I/O (Optional)

  • One 10/100/1000BASE-T Ethernet port
  • One USB 3.0 port
  • One RS-232/422/485 serial port
  • General-purpose LEDs
 

PrPMC

  • PCI (32-bit, 66/33 MHz)
  • Pn4 I/O per VITA 46.9 P64s
 

XMC

  • x4 PCI Express Gen3-capable port to XMC site 0
  • x8 PCI Express Gen3-capable port to XMC site 1
  • Pn6 I/O per VITA 46.9 X12d+X8d
 

Back Panel I/O

  • Four SATA ports capable of 6 Gb/s
  • One USB 2.0 port and one USB 3.0 port
  • Up to four RS-232/422/485 serial ports
  • Pn6 I/O per VITA 46.9 X12d+X8d
  • Pn4 I/O per VITA 46.9 P64s
  • Four 10 Gigabit Ethernet SerDes ports
  • Two 1000BASE-BX Ethernet ports
  • Two 10/100/1000BASE-T Gigabit Ethernet ports
  • Control plane Ethernet via CPU or FPGA MAC
 

FPGA

  • Xilinx Kintex UltraScale XCKU040 FPGA
  • 64 MB configuration flash
  • 509,000 effective LEs
  • 424,000 logic cells
  • 21.1 Mb total block RAM
  • 1,920 DSP slices
  • One x8 PCI Express Gen3-capable interface
  • One x1 PCI Express Gen2-capable interface
 

Additional Features

  • Non-volatile memory write protection
  • Optional Trusted Platform Module (TPM)
  • VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)
  • IEEE 1588 support (optional)
 

Software Support

 

Physical Characteristics

  • 6U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 233 mm x 160 mm
  • 0.8 in. pitch
  • 1.0 in. pitch Two-Level Maintenance (2LM)
 

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedisation levels (see the X-ES Ruggedization Chart): 1, 3, 5
  • Conformal coating available as an ordering option
  • Thermal performance will vary based on CPU frequency and application
 

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Technical documents

Ordering information

There are a number of different configurations available. Please contact Sarsen Technology for more information.

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