Products

• CPU module based on NXP MPC512x Power Architecture CPU
• e300 core built on Power Architecture technology
• Up to 400 MHz performance and 760 MIPS
• 32-bit RISC audio accelerator engine (AXE)
• PowerVR® MBX Lite 2D/3D Graphics Engine
• Evaluation Board available with exhaustive Development Kit
• FPGA on board for high flexibility
• Ready for Linux 2.6 + native component driver

CPU
NXP MPC5121e and MPC5123
e300 Power Architecture core, 90 nm process
760 MIPS @ 400 MHz

Multimedia
PowerVR MBX Lite 2D/3D Graphic Accelerator
32 bit AXE RISC Audio Accelerator

Supervisor
On board power supply supervision and power sequencer Watchdog

Memory
Cache 32 Kbyte instruction, 32 Kbyte data
SDRAM 64, 128, 256, 512 or 1024 MB DDR2
NOR 8, 16, 32, 128 MB
NAND All sizes, on request
SRAM Up to 512 Kbyte, battery backup
EEPROM 2x 32 Kbyte (1 COM Express standard EEPROM, 1 user EEPROM)

Interfaces
LAN Fast Ethernet 10/100 Mbps
UART 2x UART ports (1x full, 2x four-wires)
USB 4x 2.0 Host ports
CAN 2x ports (2.0A/B protocol)
External Bus PCI specification v2.3 compliant, 32 bit, 33/66 MHz
LPC bus
Debug JTAG IEEE 1149.1 Test Access Port (for CPU and FPGA)
PC Card SD/MMC card host controller
Audio S/PDIF serial audio interface
AC97 controller

Hard Disk Support
100 MB/s Parallel ATA IDE controller
150 MB/s Serial ATA controller
Other On-board Flash FPGA
Temperature sensor
1-wire Silicon Serial Number
GPIOs available
Configuration pins available

Video
Resolution Display Interface Unit supports up to 1280x720
Type TFT
LVDS Yes
VGA Yes
Touch Screen Yes

Mechanical
Connectors 2x COM Express type 2
1x optional connector (for COM Express enhanced versions)
Physical 95 mm x 87 mm
Temperature Commercial (0°C / +70°C) Temperature Range
Industrial (-40°C / +85°C) Temperature Range
PSU
Input 4.5V - 14V. Full regulation on board
Consumption TBD

Software
Bootloader U-Boot
Multitasking OS Linux 2.6.xx

Please contact Sarsen Technology for up to date pricing and availability information.