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Extreme Engineering Solutions Inc.

XPedite8040

P.A. Semi Dual-Core PWRficient PA6T-1682 Processor-Based AMC Module (for ATCA and ”TCA)

The Extreme Engineering XPedite8040 is a single-width, mid-size or full-size Advanced Mezzanine Card (AMC) single-board computer based on the P.A. Semi PWRficient PA6T-1682 processor.

The PA6T-1682 combines dual PA6T Power Architecture cores capable of running up to 2.0 GHz each, two DDR2 ECC SDRAM channels, and a highly configurable SERDES I/O interface.

Features:

  • P.A. Semi PWRficient PA6T-1682 processor with dual PA6T Power Architecture cores at up to 2.0 GHz each
  • Dual front-panel Gigabit Ethernet
  • Complies with AMC.0 and MicroTCA.0 (”TCA)
  • AMC.1 x8 PCI Express
  • AMC.2 10 Gigabit Ethernet XAUI
  • AMC.2 Gigabit Ethernet
  • Up to 4 GB of NAND flash
  • Two channels of DDR2 ECC SDRAM, up to 4 GB (2 GB each)
  • Up to 3 MB of LPC NOR flash
  • Front-panel Micro DB-9 RS-232 serial port
  • Linux LSP
  • VxWorks BSP
  • QNX BSP

On the XPedite8040, the PA6T-1682 supports dual front-panel Gigabit Ethernet ports, dual AMC.2 backplane Gigabit Ethernet ports, and two AMC.2 10 Gigabit Ethernet XAUI ports or one AMC.1 x8 PCI Express Fat Pipe interface. The XPedite8040 supports up to 2 GB of DDR2 ECC SDRAM per memory channel. Up to 4 GB of NAND flash, 3 MB of LPC NOR flash, and 2 MB of SPI NOR flash are also provided for non-volatile storage. The XPedite8040 can be installed in either an AMC.0 AdvancedTCA (ATCA) carrier or a MicroTCA.0 (”TCA)-compliant backplane. The XPedite8040 provides a feature-rich solution to support the next generation of high-performance and power-sensitive embedded applications. VxWorks and QNX Board Support Packages (BSPs) along with a Linux 2.4 and 2.6 LSP are available.

Processor

  • P.A. Semi PWRficient PA6T-1682 processor
  • Dual PA6T Power Architecture cores at up to 2.0 GHz each
  • 2 MB of shared L2 cache

Memory

  • Two channels of DDR2 ECC SDRAM, up to 4 GB (2 GB each)
  • Up to 4 GB of NAND flash
  • Up to 3 MB of LPC NOR flash
  • Up to 2 MB of SPI NOR flash

AMC Backplane Interconnect

  • MicroTCA.0 (”TCA) compliant
  • AMC.0 compliant
  • AMC.1 x8 PCI Express or two AMC.2 10 Gigabit Ethernet XAUI Fat Pipe
  • AMC.2 Gigabit Ethernet

Front Panel I/O

  • Dual Gigabit Ethernet ports
  • Micro DB-9 RS-232 serial port

Software Support

  • Linux LSP
  • VxWorks BSP
  • QNX BSP

Physical Characteristics

  • Single-width, mid-size or full-size AMC
  • Dimensions: 180 mm x 75 mm

Environmental Requirements

  • Operating temperature: 0 to 55 șC (ambient)
  • Humidity: 0% to 85%
  • Storage temperature: -40 to 85 șC

Power Requirements

  • 17 Watts typical, 25 Watts maximum

Please contact Sarsen Technology on +44 1672 511166 for technical support, pricing and lead time information on the full range of Extreme Engineering Solutions P. A. Semi embedded products.

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updated 26 March 2008