ECRIN Systems Launches New Remote Embedded Modular Computer - myOPALE™ - at Embedded World 2018
myOPALE™ offers disruptive technology to multiply capabilities of your next Embedded Computers in a smaller foot print thanks to PCI Express® over Cable interconnect, standard 5.25’’ Building Blocks with mini-SAS HD connectors.
Paris – February 21, 2018
In their first official participation at Embedded World (27/02 to 1/03/2018) in Nuremberg,
ECRIN Systems will launch a brand new product for Embedded and Industrial IoT markets.
Read More - Embedded World
The new computer could be considered revolutionary when we remember that for three decades Industrial PC’s always used the same two types of architecture from the 1980s: ATX/miniITX motherboard or PICMG® passive backplane. In both cases, the CPU board and its I/O cards stayed physically and mechanically linked through Peripheral Component Interconnect PCB - PCI Express®.
The
myOPALE Concept was born from four simple ideas:
- Breaking mechanical link between CPU and I/O cards thanks to PCI Express Over Cable interconnection;
- Building blocks in a standard 5.25’’ form factor;
- Re-Use of widely deployed interconnect standards from SNIA/SFF Technology Affiliate that encompass cables, connectors, form factor sizes and housing dimensions;
- Integrated thermal solution at building blocks level.