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XPedite7450


Overview

Intel® Core™ i7 Processor-Based Rugged Basic COM Express® Module

The XPedite7450 from Extreme Engineering Solutions (X-ES) is an enhanced, Type 6 COM Express™ module based on the 2nd generation Intel® Core™i7 processor or 3rd generation Intel® Core™i7 processor and Intel QM67 chipset.

The small footprint and standards-based form factor make the XPedite7450 perfect for portable and rugged environments, and for a wide range of commercial, industrial, and military applications.

Wind River VxWorks and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.

Technical

  • Supports 2nd generation and 3rd generation Intel® Core™ i7 processors
  • Quad- or dual-core processor with Intel® Hyper-Threading Technology
  • Standard COM Express® Basic form factor with ruggedisation enhancements
  • COM Express® enhanced Type 6 pinout
  • Up to 16 GB of DDR3-1600 ECC SDRAM in two channels
  • Up to 32 GB of NAND flash
  • 16 lanes of PCI Express from CPU. Default configuration is two x8 lanes.
  • Six lanes of PCI Express from Intel® QM67 chipset. Default configuration is one x4, two x1 lanes.
  • Two 10/100/1000BASE-T Gigabit Ethernet ports
  • Five USB 2.0 ports
  • Five SATA ports
  • Two digital display interfaces (DP/DVI/HDMI)
  • One VGA interface
  • Intel® High Definition Audio port
  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact Sarsen for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs

Specifications

Processor

- Quad- or dual-core Intel® Core™ i7
- Intel® Turbo Boost Technology
- Intel® Hyper-Threading Technology
- AVX instruction set extensions
- Integrated with Intel® QM67 chipset
- Dual-channel integrated memory controller
- Integrated high-performance 3D graphics controller
 

Quad-Core Processor Configurations

- Core™ i7-3612QE: 2.1 GHz, 6 MB cache
 

Dual-Core Processor Configurations

- Core™ i7-2655LE: 2.2 GHz, 4 MB cache
- Core™ i7-2610UE: 1.5 GHz, 4 MB cache
- Core™ i7-3555LE: 2.5 GHz, 4 MB cache
- Core™ i7-3517UE: 1.7 GHz, 4 MB cache
 

Memory

- Up to 16 GB of DDR3-1600 ECC SDRAM in two channels
- Up to 32 GB of NAND flash
 

Graphics

- Integrated high-performance 3D graphics controller
- Two digital display interfaces (DP/DVI/HDMI)
- VGA
 

COM Express®

- Basic form factor (95 mm x 125 mm)
- Enhanced Type 6 pinout
- Replaces LVDS with second Ethernet port and one SATA port capable of 3 Gb/s
- Adds non-volatile write protect
- Adds two external interrupts
 

Interface

- Five USB 2.0 ports
- Five SATA ports capable of 3 Gb/s
- Intel® High Definition Audio port
- 16 lanes of PCI Express from CPU. Default configuration is two x8 lanes.
- Six lanes of PCI Express from Intel® QM67 chipset. Default configuration is one x4, two x1 lanes.
- Two serial ports
- LPC
- SMB
- I²C
 

Ruggedization and Reliability

- Class III PCB fabrication and assembly
- Soldered DDR3 ECC SDRAM
- Tin whisker mitigation
- Designed and tested for extended solder joint reliability
- Additional mounting holes for rugged and conduction-cooled environments
- BIT support
 

Security and Management

- Optional Trusted Platform Module (TPM)
- Non-volatile memory write protection
 

Software Support

- Wind River VxWorks BSP
- Linux BSP
- Microsoft Windows drivers
- Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs
 

Physical Characteristics

- Dimensions: 95 mm x 125 mm
 

Technical documents

Ordering information

There are a number of configurations available. Please contact Sarsen Technology to discuss your application.