• Supports Intel® Xeon® D-2700 series (formerly Ice Lake-D) processors
• Up to 20 Xeon®-class cores in a single, power-efficient SoC package
• SKUs available with native extended temperature support
• Designed with SecureCOTS™ technology to support enhanced security and trusted computing
• Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash
• 3U VPX (VITA 46) module
• Compatible with multiple VITA 65 OpenVPX™ slot profiles
• Ruggedized Enhanced Design Implementation (REDI) per VITA 48
• 64 GB of DDR4 ECC SDRAM in four channels
• 32 GB of SLC NAND flash
• Dual 100GBASE-KR4 Ethernet ports (up to 100 Gbps aggregate processor throughput)
• One 10/100/1000BASE-T Ethernet port
• Two x4 Gen3, one x4 Gen2, and two x2 Gen2 PCI Express interfaces
• Two USB 2.0 ports
• Two RS-232/422/485 serial ports
• RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support
• SOSA-aligned pinout support (contact factory for details)
• Wind River VxWorks BSP
• X-ES Enterprise Linux (XEL) BSP
• Contact Sarsen Technology for PCI Express Gen4 and alternative Ethernet configuration availability
• Contact Sarsen Technology for availability of Microsoft Windows drivers and other operating systems

 Processor

• Intel® Xeon® D-2700 series (formerly Ice Lake-D) processor
• Up to 20 Xeon®-class cores in a single, power-efficient SoC package
• SKUs available with native extended temperature support

• 64 GB of DDR4 ECC SDRAM in four channels
• 32 GB of SLC NAND flash
• 64 MB NOR boot flash
• 64 kB EEPROM

• Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash
• Designed with SecureCOTS™ technology to support enhanced security and trusted computing
• System voltage monitor, power-on/reset control, non-volatile write-protection control
• Trusted Platform Module (TPM)

• Dual 100GBASE-KR4 Ethernet ports (up to 100 Gbps aggregate processor throughput) to P1.A and P1.B
• One x4 PCI Express Gen3-capable interface to P1.C

• One 10/100/1000BASE-T Ethernet port
• One x4 PCI Express Gen3-capable interface
• One x4 PCI Express Gen2-capable interface
• Two x2 PCI Express Gen2-capable interfaces
• Two USB 2.0 ports
• Two RS-232/422/485 serial ports
• Four single-ended FPGA GPIOs

• RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support
• UEFI firmware
• Wind River VxWorks BSP
• X-ES Enterprise Linux (XEL) BSP
• Contact factory for availability of Microsoft Windows drivers and other operating systems

• 3U VPX-REDI conduction- or air-cooled form factor
• SOSA-aligned pinout support (contact factory for details)
• Dimensions: 100 mm x 160 mm
• 0.8 in. pitch without solder-side cover
• in. pitch with Two-Level Maintenance (2LM) support

• Contact factory for appropriate board configuration based on environmental requirements
• Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
• Conformal coating available as an ordering option
• Thermal performance will vary based on CPU frequency and application
• Contact X-ES for air-cooled development options

• Power will vary based on configuration and usage. Please consult factory