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XPedite2570


Overview

3U VPX Xilinx Kintex UltraScale FPGA-Based Fibre-Optic I/O Module

The XPedite2570 from Extreme Engineering Solutions (X-ES) is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the Xilinx Kintex UltraScale family of FPGAs.

With multiple high-speed fabric interfaces, x8 PCI Express Gen3, 12 high-speed fiber-optic transceivers, and 8 GB of DDR4-2400 SDRAM in two channels, the XPedite2570 is ideal for customisable, high-bandwidth, signal-processing applications.

The XPedite2570 is a reconfigurable FPGA resource designed to meet the demands of high-bandwidth applications such as packet processing, signal processing, and DSP-intensive applications. It features 12 rugged, protocol-independent fiber optic transceivers operating at up to 10.3125 Gb/s, along with 8 GB of DDR4 ECC SDRAM in two independent channels capable of up to 38 GB/s aggregate bandwidth.

The XPedite2570 has several options for high-performance backplane I/O, including a x8 Gen3 PCI Express interface, dual GTH transceivers with a maximum data rate of 16.375 Gb/s, and up to 44 LVDS transceivers for user I/O.

The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded, streaming-data applications and simplify FPGA development. X-ES’ FDK includes IP blocks, HDL, test benches, Linux drivers, and complete example designs for the XPedite2570.
 

Technical

  • Xilinx Kintex® UltraScale™ XCKU115 FPGA
  • 3U VPX (VITA 46) module
  • Twelve 10.3125 Gb/s optical transmitter links
  • Twelve 10.3125 Gb/s optical receiver links
  • 8 GB of DDR4-2400 ECC SDRAM in two channels
  • Non-volatile FPGA dual quad-SPI configuration flash
  • x8 PCI Express Gen3 to P1.A
  • Two GTH-capable High-Speed Serial (HSS) lanes
  • 44 LVDS GPIO
  • Ten single-ended (SE) GPIO
  • FPGA Development Kit (FDK)
  • Linux drivers

Specifications

FPGA

  • Xilinx Kintex® UltraScale™ XCKU115 FPGA for high-performance logic and DSP applications
  • 8 GB of DDR4-2400 ECC SDRAM in two channels
  • 1 GBit of configuration NOR Flash


Optical Interfaces

  • 12-channel transmitter and receiver modules
  • 14 Gb/s max line rate
  • Socketed Samtec FireFly optics
  • I²C register interfaces
  • Industrial temperature range


VPX (VITA 46) P1 I/O

  • One x8 PCI Express Gen3 interface to P1.A
  • Two additional GTH-capable High-Speed Serial (HSS) lanes
  • Twelve LVDS and two single-ended GPIO


VPX (VITA 46) P2 I/O

  • Thirty-Two LVDS and eight single-ended GPIO


Development Support

  • X-ES FPGA Development Kit (FDK)
  • Linux drivers


Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 in. and 1.0 in. pitch with solder-side cover


Environmental Requirements

Contact Sarsen for appropriate board configuration based on environmental requirements.
  • Supported ruggedisation levels (see the X-ES Ruggedization Chart): 3, 5
  • Conformal coating available as an ordering option


Power Requirements

  • Power will vary based on configuration and usage. Please call Sarsen to discuss your requirements.

Technical documents

Ordering information

There are a number of different configurations available.  Please contact Sarsen Technology to discuss your project requirements.

Software

NEWS

Associated products