Processor
- Intel® Xeon® D (formerly Broadwell-DE)
- Up to eight Xeon®-class cores in a single, power-efficient SoC package
Memory
- Up to 8 GB of DDR3-1600 ECC SDRAM in two channels (available now)
- Up to 16 GB of DDR4-2133 ECC SDRAM in two channels (available in Q4 2015 when industrial DDR4 is available)
- Up to 64 GB of NAND flash
- 32 MB NOR boot flash
- 64 kB EEPROM
VPX (VITA 46) P0 I/O
- I²C port
VPX (VITA 46) P1 I/O
- One 10GbE XAUI or 10GBASE-KX4
- x4 PCI Express Gen3-capable interface to P1.B
- Two 1000BASE-BX Gigabit Ethernet ports
- XMC P16 I/O, mapping P1w9-X12d per VITA 46.9
VPX (VITA 46) P2 I/O
- One 10GbE XAUI or 10GBASE-KX4
- Two 10/100/1000BASE-T Gigabit Ethernet ports
- Four SATA ports capable of 6 Gb/s
- Two USB 2.0 ports
- Up to four RS-232/422/485 serial ports
- 3.3 V GPIO signals
XMC Site
- x8 PCI Express Gen3-capable port (XMC interface)
- One SATA port (XMC interface)
Additional Features
- Non-volatile memory write protection
- Optional Trusted Platform Module (TPM)
- IEEE 1588 support on four Gigabit Ethernet ports
Software Support
-
coreboot firmware powered by Intel® FSP
- Wind River VxWorks BSP
-
X-ES Enterprise Linux (XEL) BSP
- Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- Dimensions: 100 mm x 160 mm
- 0.8 in. pitch without solder-side cover
- 1.0 in. pitch with Two-Level Maintenance (2LM) support (optional)