TOTAL: £0.00
home

email


Products

XPedite2500


Overview

Xilinx Kintex® UltraScale™ FPGA-Based Conduction- or Air-Cooled XMC Module
The XPedite2500 from Extreme Engineering Solutions (X-ES) is a configurable, high-performance, conduction- or air-cooled XMC module based on the Xilinx Kintex® UltraScale™ family of FPGAs.

With a range of high-density and high-bandwidth I/O, the XPedite2500 is ideal for user-customisable, high-bandwidth data processing applications.

The XPedite2500 is capable of interfacing to and processing streaming data from a wide variety of inputs. It features up to two x8 PCI Express Gen3 interfaces and up to 8 GB of DDR4-2400 SDRAM available in four 32-bit channels. The x8 PCI Express Gen3 interface on the P16 connector can optionally be replaced with up to eight High-Speed Serial (HSS) ports. LVDS I/O is available via P16, and an optional P14 connector can provide additional LVDS and LVCMOS I/O.

Technical

  • Xilinx Kintex® UltraScale™ FPGA XCKU115
  • Conduction- or air-cooled XMC module
  • Up to 8 GB of DDR4-2400 SDRAM in four 32-bit channels
  • x8 PCI Express Gen3 interface to P15
  • x8 PCI Express Gen3 interface or up to eight High-Speed Serial (HSS) ports to P16
  • 19 LVDS to P16
  • 26 LVDS to P14 (optional)
  • 12 LVCMOS (1.8 V) to P14 (optional)
  • Dual-QSPI FPGA configuration flash
  • FPGA Development Kit (FDK)
  • Linux drivers

Specifications

FPGA

  • Xilinx Kintex® UltraScale™ for high-performance logic and DSP applications
  • Standard FPGA is Xilinx Kintex® Ultrascale™ XCKU115
  • Support for commercial and industrial temperature, as well as -1, -2, -3 speed grades


Memory

  • Up to 8 GB of DDR4-2400 SDRAM in four 32-bit channels
  • Dual-QSPI FPGA configuration flash


XMC Site

  • x8 PCI Express Gen3 interface


P14 User I/O (Optional)

  • 26 LVDS user I/O to FPGA
  • 12 LVCMOS (1.8 V) user I/O to FPGA


P15 I/O

  • x8 PCI Express Gen3 interface compliant with VITA 42.3


P16 I/O

  • x8 PCI Express Gen3 interface compliant with VITA 42.3 or up to eight High-Speed Serial (HSS) ports
  • 19 LVDS user I/O to FPGA


Development Support

  • X-ES FPGA Development Kit (FDK)
  • Linux drivers


Physical Characteristics

  • Conduction- or air-cooled XMC form factor
  • Dimensions: 149 mm x 74 mm


Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
  • Conformal coating available as an ordering option


Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Technical documents

Ordering information

Please contact Sarsen to discuss the correct configuration for your application.

Software

NEWS

Associated products