Products

Ares Agilex™ 7 FPGA SoC F-Series module

Overview

The Ares SoM is an Agilex™ SoC F-Series system-on-module, based on the Intel® Agilex™ 7 FPGA SoC F-Series FPGA.

The main advantage of the Agilex™ 7 SoC F-Series FPGA is its flexibility and high-performance capabilities, enabling designers to efficiently implement complex algorithms and integrate multiple functions onto a single chip, resulting in reduced power consumption, and improved system performance and technology.

The system-on-module (module SoM) is delivered with an active heatsink with heat spreader and fan, and is specifically optimized for embedded applications. Using a module for an embedded system can simplify the design process and reduce time-to-market by providing pre-built, tested components that can be easily integrated into your system.

Target markets of this Agilex™ SoC F-Series module include Bioscience, High Precision Measurement, Radar Systems, Electronic Warfare, and much more.

The Ares Agilex™ SoC F-Series module will be fully compatible its the carrier board (available soon).

Technical

Intel® Agilex™ 7 FPGA SoC F-Series
AGF012
PCIe Gen4 x4 Root Complex
PCIe Gen4 x16 End Point
Quad-Core ARM Cortex A-53
84x LVDS + 140 GPIOs
32 transceivers @32Gbps NRZ OR up to 24 transceivers @58Gbps PAM4
Industrial Temp Grade
Long Term Supply
Designed for Bioscience, High Precision Measurement, Radar Systems, Electronic Warfare and "Customizable" markets

Specifications

Features	Ares Agilex™ 7 FPGA SoC F-Series
FPGA SoC	Agilex™ 7 FPGA SoC F-Series AGF012, AGFB012R24C2I2V, R24C package 1178 KLE, M20K 110Mbit, 3743 DSP Blocks Quad Core Arm Cortex-A53 up to 1.43GHz Transceiver speed grade 2, Core speed grade 2 Industrial Temp Grade
DDR4 Memory	3 banks DDR4, 24 Gbyte total	HPS= 1 bank DDR4 x72bit bus, 8GByte, @2666MT/s
		FPGA= 2 banks DDR4 x72bit bus, 8GByte each, @2666MT/s
Connectors	Transceiver Mezzanine Connector	32 transceivers @32Gbps NRZ OR up to 24 transceivers @58Gbps PAM4 (example: 16 transceivers @32Gbps NRZ + 16 @58Gbps PAM4)
	IO Mezzanine Connector	LVDS = 42 RX pairs and 42 TX pairs @1400Mbps FPGA GPIOs = 140 HPS IO = depending used interfaces
FPGA Configuration	2Gbit Quad SPI Flash (store up to 2 images)
Software Configuration	128Gbyte NAND Flash eMMC (Stores U-Boot, Linux Kernel, and RootFS) (SD Card support on the carrier board)
HPS Communication	1GbE RGMII, I2C, UART, USB 2.0 OTG, SPI slave and master, HPS IO
Mechanical & Environmental Specification	Module rugged for shocks and high vibration IEC/EN61000 (EMI immunity), EN61000 + EN55032 (EMI emission), EN60068 (Vibration: sinusoidal, 10Hz - 2KHz, +/- 0.15mm, 2g ; Shock: half-sinusoidal, 11ms, 15g) 5-15V Power Input Industrial temperature grade -40°C to +70°C (to be qualified) Conformal coating (option on request)
Power & Dissipation	Typ 113W, active airflow cooling (heat spreader + heatsink + fan) fan noise < 50dB
Board Management Controller	Communication with Carrier board: I2C, PWM, JTAG Communication with FPGA : 1x UART to FPGA Monitoring : Current, voltages, temperature, ID information Programming : Clock Control: Power, temperature protection, Fans
Module dimensions	TBC: 107mm x 85mm (4.2 x 3.4 inches) / 12mm+ thickness (38.6mm with active heatsink and heat spreader)
Deliverables	• Ares module & its active heatsink system • Board Support Package (to download from our online technical support) after purchase of a module and its carrier board: Starter Guide, module and carrier board Reference Manuals, Interconnect pinout file Mechanical drawings, assembly files FPGA GHRD/GSRD Test Designs by interface (Quartus Prime Pro Edition 22.4) BMC Software API HPS Software: -- Built with Yocto Project version 4.1 (langdale) -- U-Boot bootloader (v2022.07), ATF Linux kernel (v5.15) and linux Poky distribution • 1-year technical support and 1-year warrantee • Online support at support.reflexces.com
Ordering Information	RXCAGF012PR24-SOM00I Availability: Samples End Q4-2023
MOTS = Modified version on request	R24C package compatible from 800KLE (AGF008) up to 2.7MLE (AGF027) Contact sales for customization

Ordering information

For more information, please contact us.

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