• Supports Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
• Up to 16 Xeon®-class cores in a single, power-efficient SoC package
• 4, 8, or 12 core SKUs available with native extended temperature support
• 3U VPX (VITA 46) module
• Optional VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)
• Compatible with multiple VITA 65 OpenVPX™ slot profiles (SOSA-aligned configurations available)
• Ruggedized Enhanced Design Implementation (REDI) per VITA 48
• Conduction- or air-cooled
• Up to 32 GB of DDR4 ECC SDRAM in two channels
• Up to 32 GB of SLC NAND flash
• XMC interface with a x8 PCIe interface and rear I/O support
• One x8 or two x4 PCI Express backplane fabric interconnects
• Two 10GBASE-KR Ethernet ports
• One Gigabit Ethernet port
• Two USB 2.0 ports
• One RS-232/422/485 serial port
• Two SATA ports
• Wind River VxWorks BSP
• X-ES Enterprise Linux (XEL) BSP
• Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Processor

• Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
• Up to 16 Xeon®-class cores in a single, power-efficient SoC package
• 4, 8, or 12 core SKUs available with native extended temperature support

Memory

• Up to 32 GB of DDR4 ECC SDRAM in two channels
• Up to 32 GB of NAND flash
• 32 MB NOR boot flash
• 64 kB EEPROM

VPX (VITA 46) P0 I/O

• VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)
• 1 Pulse Per Second (1PPS)

VPX (VITA 46) P1 I/O

• x4 PCI Express Gen3-capable interface to P1.A
• x4 PCI Express Gen3-capable interface to P1.B
• Two 10GBASE-KR Ethernet ports
• XMC P16 I/O, mapping P1w9-X12d per VITA 46.9
• 3.3 V GPIO signals

VPX (VITA 46) P2 I/O

• One 10/100/1000BASE-T Gigabit Ethernet port
• Two SATA ports capable of 6 Gb/s
• Two USB 2.0 ports
• One RS-232/422/485 serial port

XMC Site

• x8 PCI Express Gen3-capable interface
• X12d P16 I/O

Additional Features

• Non-volatile memory write protection
• Optional Trusted Platform Module (TPM 2.0)
• IEEE 1588 support on one Gigabit Ethernet port

Software Support

• Wind River VxWorks BSP
• X-ES Enterprise Linux (XEL) BSP
• Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Physical Characteristics

• 3U VPX-REDI conduction- or air-cooled form factor
• Dimensions: 100 mm x 160 mm
• 0.8 in. pitch without solder-side cover (optional)
• 1.0 in. pitch with Two-Level Maintenance (2LM) support

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
• Conformal coating available as an ordering option
• Thermal performance will vary based on CPU frequency and application
• Contact X-ES for air-cooled development options

Power Requirements

• Power will vary based on configuration and usage. Please consult factory.