Remote Embedded Modular Computers
myOPALE from ECRIN Systems provides a simple solution for applications that need more I/O boards than can be fitted in a standard Industrial PC based on backplane PCB.
myOPALE concept is based on four major principles:
- Remove mechanical link between CPU and I/O cards thanks to PCI Express Over Cable interconnection;
- Building blocks in a standard 5.25’’ form factor;
- Re-Use of widely deployed interconnect standards from SNIA/SFF Technology Affiliate that encompass cables, connectors, form factor sizes and housing dimensions;
- Thermal solution at building blocks level.
The CPU module incorporates all the features of an embedded computer into a small form factor 5.25’’ site with less than 8" depth.
The design is based on COM Express Type 6 and integrates Embedded Low Power SKU’s with 10 years life support. In Skylake and Kaby Lake versions, Intel Core i7 or Xeon E3-1500 CPU with Chipset platforms are selected, which directly drive 24 PCIe Gen3 lanes as their expansion bus.
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