Products

• Supports Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
• Up to 16 Xeon®-class cores in a single, power-efficient SoC package
• 4, 8, or 12 core SKUs available with native extended temperature support
• Standard COM Express® Basic form factor with ruggedization enhancements
• COM Express® enhanced Type 7 pinout
• Up to 32 GB of DDR4-2133 ECC SDRAM in two channels
• 24 lanes of PCIe Gen3, available as one x8 PCIe interface and one x16 PCIe interface
• Up to 8 lanes of PCIe Gen2 (eight x1 interfaces)
• Two 10GBASE-KR Ethernet ports
• One Gigabit Ethernet port (optional)
• Four USB 3.0 ports
• Two SATA ports
• Two LVTTL serial ports
• Wind River VxWorks BSP
• X-ES Enterprise Linux (XEL) BSP
• coreboot firmware powered by Intel® FSP
• Contact Sarsen Technology for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Processor

• Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
• Up to 16 Xeon®-class cores in a single, power-efficient SoC package
• 4, 8, or 12 core SKUs available with native extended temperature support

Memory

• Up to 32 GB of DDR4-2133 ECC SDRAM in two channels
• Up to 32 GB of SLC NAND flash
• 32 MB NOR boot flash
• 64 kB EEPROM

COM Express®

• Basic form factor (95 mm x 125 mm)
• Enhanced Type 7 pinout
• Adds non-volatile write protect
• Adds two external interrupts
• Adds boot flash select

RuggediSation and Reliability

• Class III PCB fabrication and assembly
• Soldered DDR4 ECC SDRAM
• Tin whisker mitigation
• Designed and tested for extended solder joint reliability
• Additional mounting holes for rugged and conduction-cooled environments
• BIT support

Interface

• Four USB 3.0 ports
• Two SATA ports capable of 6 Gb/s
• Two 10GBASE-KR Ethernet ports with management sideband signals
• One 10/100/1000BASE-T Ethernet port (optional)
• One x16 PCI Express Gen3-capable interface
• One x8 PCI Express Gen3-capable interface
• Up to eight x1 PCI Express Gen2-capable interfaces
• Two LVTTL serial ports
• LPC
• Eight GPIO interfaces

Additional Features

• Non-volatile memory write protection
• Optional Trusted Platform Module (TPM)

Software Support

• coreboot firmware powered by Intel® FSP
• Wind River VxWorks BSP
• X-ES Enterprise Linux (XEL) BSP
• Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Physical Characteristics

• COM Express® Basic (Type 7) form factor
• Dimensions: 95 mm x 125 mm

Environmental Requirements

• Supported ruggedisation levels (see the X-ES Ruggedisation Chart): 1, 3, 5
• Conformal coating available as an ordering option

Power Requirements

• Power will vary based on configuration and usage. Please consult factory.