Please contact Sarsen Technology to request a datasheet.
The GM61’s integrated Xilinx RFSoC combines FPGA processing and A/D and D/A converters in a single chip, giving the board remarkable density and performance:
- 2-Channel 4.0-5.0GSps 12/14b ADC
- 8-Channel 6.4-10.0GSps 14b DAC
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Also available:
- 8 ADC & 2 DAC Channels – WWGM62
- 4 ADC & 4 DAC Channels – WWGM63
The GM61 provides high fidelity and high speed analog-to-digital and digital-to-analog conversion along with a rugged design.
For large deployments requiring significant processing capability, synchronize multiple RFSoC cards.
The GM61 is shipped with a custom heatsink which enables proper cooling. An on-board temperature monitor is also supplied which allows for real-time monitoring of the RFSoC’s internal die temperature.
The Board Support Interface is available in VHDL or CoreFire Next Application Design Suite.
There are a number of configurations available. Please contact Sarsen Technology to discuss the best one for your application.