Rugged 12G-SDI XMC Video Capture Card - VC300xX - Sarsen Technology
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VC300xX


Overview

Rugged 12G-SDI XMC Video Capture Solution for Real-Time Processing


The Condor VC300xX is an XMC form factor Ultra High Definition (UHD) video capture solution engineered by EIZO Rugged Solutions for demanding, high-performance embedded video applications. It delivers raw video data directly to the host system over PCIe with ultra-low latency (< 50 ms capture-to-display), enabling real-time viewing, sensor fusion, AI analysis, or local rendering on a companion GPU. Designed for versatile multi-channel signal ingestion, the

Condor VC300xX supports up to eight SDI video capture inputs across a mix of 12G-SDI, 3G-SDI, and HD-SDI resolutions, alongside two legacy CVBS (NTSC/PAL) channels and stereo audio inputs. With power consumption under 20W, the module offers an ideal balance of performance and SWaP-C efficiency for compact, mission-critical platforms such as UAV payloads, surveillance systems, and naval or vetronics vetronics installations.
 

Technical

  • High-Density SDI Ingestion: Supports up to eight SDI video capture inputs configurable across 12G-SDI, 3G-SDI, and HD-SDI resolutions (100 Ω differential).
  • Legacy Video & Audio Support: Includes two single-ended CVBS (NTSC/PAL, 75 Ω) video inputs and two stereo audio input channels.
  • Ultra-Low Latency: Achieves sub-50 ms capture-to-display latency for real-time situational awareness and mission-critical workflows.
  • High-Speed PCIe Interface: Direct raw video delivery over PCIe Gen 3 (x4 or x8 lanes) to minimize CPU overhead.
  • Low-Power SWaP Design: Operates at less than 20W, making it suitable for thermally and power-constrained airborne and mobile applications.
  • Backplane Integration: Features VITA 46.9 VPX I/O signal mapping supporting X12d, X8d, and X16s pinouts for VITA and SOSA-aligned architectures.
  • Ruggedised Construction: Available in conduction-cooled (CC4, -40°C to +85°C) and air-cooled (AC3, -40°C to +70°C) variants compliant with VITA 47.3 and MIL-STD-810.

Specifications

Specification Details
Form Factor / Interface XMC 1.0, XMC 2.0 (XMC+ available)
x4 or x8 PCI Express Gen 3
Capture Format Raw uncompressed video capture over PCIe
Video Inputs Up to 8x SDI inputs (12G-SDI, 3G-SDI, and HD-SDI, 100 Ω differential)
2x CVBS inputs (NTSC/PAL, 75 Ω single-ended)
Audio Inputs 2x Stereo Audio channels
Latency < 50 ms (capture to display)
I/O Mapping VITA 46.9 VPX pin mapping (X12d, X8d, X16s)
Power Consumption < 20W
Operating Temperature -40°C to +85°C (CC4 Conduction Cooled)
-40°C to +70°C (AC3 Air Cooled)
Environmental (VITA 47.3) Shock: 40 g
Vibration: Class V3 (0.10 g²/Hz)
Humidity: 95% without condensation
Carrier Compatibility VPX, VME, CompactPCI (cPCI), and PCIe (via carrier/adapter boards)
Software & OS Support Windows or Linux on x86 or ARM architectures
Comprehensive SDK included

Ordering information

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