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Backplanes

Product comparison


Sarsen Technology provides a range of high reliability and rugged PICMG 1.3 backplanes in a variety of form factors to support diverse computer system designs.

These PCIe backplanes support one or more single or dual-processor single board computers, as well as multiple PCIe, PCI-X, PCI and ISA plug-in I/O card slot combinations to address the needs of critical industrial and military applications.

Trenton Systems Backplanes

This web site can only detail a representative sample of the complete range. For a detailed review of your application please contact one of the engineering team to discuss your requirements.

 


  • Filter results

    • Manufacturer

        Trenton Systems
    • Form Factor

        PCI Express 2U Butterfly HDEC Midsize
    • Processor

        SBC Options Available
    • Max Operating Temperature

        0°C to 50°C 0°C to 60°C
    • Dimensions

        4 8
    • x16 PCIe Gen3

        37.1cm x 8.4cm
    • x8 PCIe Gen3

        2
    • x4 PCIe Gen3

        5 4
    • x4 PCIe Gen2

        1
Product name Manufacturer Form Factor Processor Max Operating Temperature Dimensions x16 PCIe Gen3 x8 PCIe Gen3 x4 PCIe Gen3 x4 PCIe Gen2
  Filter Filter Filter Filter Filter Filter Filter Filter Filter
Trenton Systems
PCI Express
2U Butterfly
HDEC Midsize
SBC Options Available
0°C to 50°C
0°C to 60°C
4
8
37.1cm x 8.4cm
2
5
4
1
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BPG8194

High Density PCI Express 3.0 Backplane

Trenton Systems

PCI Express

SBC Options Available

0°C to 50°C

8

5

BPG8150

PICMG 1.3 PCI Express SFF Backplane

Trenton Systems

PCI Express

SBC Options Available

0°C to 60°C

4

2

1

HDB8227

HDEC Series 2U Butterfly Backplane

Trenton Systems

2U Butterfly

SBC Options Available

0°C to 50°C

37.1cm x 8.4cm

4

HDB8228

HDEC Series Midsize Backplane

Trenton Systems

HDEC Midsize

SBC Options Available

0°C to 50°C

4

4