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XPedite5850

Overview

NXP QorIQ T4240 12-Core COM Express Mezzanine Module

The XPedite5850 from Extreme Engineering (X-ES) supports the NXP (formerly Freescale) QorIQ T4 processors. With 12 dual-threaded Power Architecture® e6500 cores running at up to 1.667 GHz and up to 16 GB DDR3-1866 ECC SDRAM in two channels, the T4240 delivers enhanced performance and efficiency for today's embedded computing applications.

The rugged COM Express® module complies with the COM Express® Basic form factor (95 mm x 125 mm) and supports an enhanced Type 5-based pinout.
 
  • XPedite5850 XPedite5850

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Technical

  • NXP QorIQ T4240 processor with 12 dual-threaded Power Architecture® e6500 cores at up to 1.667 GHz
  • Alternate NXP QorIQ processors: T4160 and T4080
  • Conduction or air cooling
  • COM Express® Basic form factor (95 mm x 125 mm)
  • Extended shock and vibration tolerance
  • Up to 16 GB of up to DDR3-1866 ECC SDRAM in two channels
  • x8 PCI Express interface
  • x4 PCI Express interface
  • Up to four 10 Gigabit Ethernet ports
  • Eight Gigabit Ethernet ports
  • Two USB 2.0 ports
  • Two SATA ports
  • Two serial ports
  • Up to 256 MB of NOR flash (with redundancy)
  • Up to 32 GB of NAND flash
  • NXP hypervisor support for secure partitioning
  • Wind River VxWorks BSP
  • Linux BSP
  • Green Hills INTEGRITY-178 BSP
  • Contact factory for availability of QNX Neutrino and LynuxWorks LynxOS BSPs

Specifications

Processor
  • NXP (formerly Freescale) QorIQ T4240 processor
  • 12 dual-threaded Power Architecture® e6500 cores at up to 1.667 GHz
  • 2 MB L2 cache per quad
  • 512 kB platform cache per channel (3)
  • IEEE 754 Floating-Point Unit (FPU) support
  • 128-bit AltiVec engine per core

Alternate Processor Configurations
  • T4160 processor with eight dual-threaded Power Architecture® e6500 cores up to 1.667 GHz
  • T4080 processor with four dual-threaded Power Architecture® e6500 dual cores up to 1.667 GHz

Memory
  • Up to 16 GB of up to DDR3-1866 ECC SDRAM in two channels
  • Up to 256 MB of NOR flash (with redundancy)
  • Up to 32 GB of CPU NAND flash

Ruggedisation and Reliability
  • Class III PCB fabrication and assembly
  • Soldered DDR3 ECC SDRAM
  • Tin whisker mitigation
  • Designed and tested for extended solder joint reliability
  • Additional mounting holes for rugged and conduction-cooled environments
  • Bootloader and BIT support

Interface
  • Up to two 10GBASE-T Ethernet ports
  • Two 10GBASE-KR Ethernet ports
  • Two 10/100/1000BASE-T Ethernet ports
  • Six 1000BASE-X Ethernet ports
  • SPI interface with two chip selects
  • Processor IEEE 1588 pins
  • Two PCIe interfaces (x8, x4)
  • Two USB 2.0 ports
  • Two SATA ports capable of 3 Gb/s
  • Two TTL-level serial ports
  • Two I²C ports

COM Express®
  • Type 5-based pinout, see board user manual for details
  • Basic form factor (95 mm x 125 mm)

Software Support
  • Wind River VxWorks BSP with optional NXP hypervisor support for secure partitioning
  • Linux BSP with optional NXP hypervisor support for secure partitioning
  • Green Hills INTEGRITY-178 BSP
  • Contact factory for availability of QNX Neutrino and LynuxWorks LynxOS BSPs

Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
  • Supported ruggedisation levels (see the X-ES Ruggedization Chart): 1, 3, 5
  • Conformal coating available as an ordering option

Power Requirements
  • Power will vary based on configuration and usage. Please consult factory.

Technical documents

Ordering information

There are a number of different configurations available. Please contact Sarsen Technology to discuss your application.

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