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Xpedite7771


Overview

Intel® Xeon® D-1700 Processor-Based 3U VPX-REDI Module with 48 GB of DDR4, 100 Gigabit Ethernet, and SecureCOTS™

The XPedite7771 from Extreme Engineering Solutions,  is a secure, high-performance single board computer based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors, making it an optimal choice for computationally heavy applications requiring maximum data and information protection.

This 3U VPX-REDI module integrates SecureCOTS™ technology with a Microsemi® PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.

The XPedite7771 provides incredible speed with two 100GBASE-KR4 and one 10/100/1000BASE-T Ethernet ports. The dual 100GBASE-KR4 Ethernet ports offer fallback redundancy to help ensure a consistent processor throughput of up to 100 Gbps is available at all times. The XPedite7771 also accommodates up to 48 GB of DDR4 ECC SDRAM in three channels and up to 32 GB of onboard SLC NAND flash in addition to numerous I/O ports, including USB 2.0, PCI Express, and RS-232/422/485 serial through the backplane connectors.

An integrated XMC site provides additional expansion capabilities, including a x8 PCI Express connection to the Intel® Xeon® D processor.
Wind River VxWorks and X-ES Enterprise Linux (XEL) Board Support Packages (BSPs) are available.
 

Technical

  • Supports Intel® Xeon® D-1700 series (formerly Ice Lake-D) processors
  • Up to 10 Xeon®-class cores in a single, power-efficient SoC package
  • SKUs available with native extended temperature support
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash
  • 3U VPX (VITA 46) module
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • Compatible with multiple VITA 65 OpenVPX™ slot profiles
  • 48 GB of DDR4 ECC SDRAM in three channels
  • 32 GB of SLC NAND flash
  • XMC site with x8 PCI Express interface
  • Dual 100GBASE-KR4 Ethernet ports (up to 100 Gbps aggregate processor throughput)
  • One 10/100/1000BASE-T Ethernet port
  • Four x4 Gen3 PCI Express interfaces
  • Two USB 2.0 ports
  • Two RS-232/422/485 serial ports
  • RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact Sarsen for availability of Microsoft Windows drivers and other operating 

Specifications

Processor
  • Intel® Xeon® D-1700 series (formerly Ice Lake-D) processor
  • Up to 10 Xeon®-class cores in a single, power-efficient SoC package
  • SKUs available with native extended temperature support

Memory
  • 48 GB of DDR4 ECC SDRAM in three channels
  • 32 GB of SLC NAND flash
  • 64 MB NOR boot flash
  • 64 kB EEPROM

Security and Management
  • Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • System voltage monitor, power-on/reset control, non-volatile write-protection control
  • Trusted Platform Module (TPM)

VPX (VITA 46) P0 I/O
  • Two IPMB connections to an IPMI Controller

VPX (VITA 46) P1 I/O
  • Dual 100GBASE-KR4 Ethernet ports (up to 100 Gbps aggregate processor throughput) to P1.A and P1.B
  • One x4 PCI Express Gen3-capable interface to P1.C

VPX (VITA 46) P2 I/O
  • One 10/100/1000BASE-T Ethernet port
  • Three x4 PCI Express Gen3-capable interfaces
  • Two USB 2.0 ports
  • Two RS-232/422/485 serial ports
  • Four single-ended FPGA GPIOs

Software Support
  • RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support
  • UEFI firmware
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact factory for availability of Microsoft Windows drivers and other operating systems

XMC Site
  • One x8 PCI Express Gen2-capable interface

Physical Characteristics
  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 1.0 in. pitch with Two-Level Maintenance (2LM) support

Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements
  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
  • Conformal coating available as an ordering option
  • Thermal performance will vary based on CPU frequency and application
  • Contact X-ES for air-cooled development options

Power Requirements
  • Power will vary based on configuration and usage. Please consult factory.

Ordering information

There are a range of options available. Please contact Sarsen to discuss your project requirements