XPedite7872 - Intel® Xeon® D-2800 Processor-Based 3U VPX-REDI Module with 64 GB of DDR4, 100 Gigabit Ethernet, and SecureCOTS™ - Sarsen Technology
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XPedite7872


Overview

Intel® Xeon® D-2800 Processor-Based 3U VPX-REDI Module with 64 GB of DDR4, 100 Gigabit Ethernet, and SecureCOTS™

The XPedite7872 is a secure single board computer based on the Intel® Xeon® D-2800 series (formerly Eddy Lake) of processors and aligned to the Sensor Open System Architecture (SOSA) Payload / Compute Intensive profiles (SLT3-PAY-1F1U1S1S1U1U4F1J-14.6.11-0 and SLT3-PAY-1F1U1S1S1U1U4F1J-14.6.13-0).

It accommodates up to 64 GB of DDR4 ECC SDRAM in four channels and up to 256 GB of onboard NAND flash, in addition to four x4 PCI Express Gen3-capable interfaces (also configurable as two x8 interfaces or one x16 interface).

For applications requiring fast data transfer, the XPedite7872 provides one 100GBASE-KR4 Ethernet port, one 25G/10GBASE-KR Ethernet port, and one 1000BASE-KX Ethernet port.  

The XPedite7872 integrates SecureCOTS™ technology with a Microchip PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.

 

Technical

  • Supports Intel® Xeon® D-2800 series (formerly Eddy Lake) processors
  • Up to 20 Xeon®-class cores in a single, power-efficient SoC package
  • SKUs available with native extended temperature support
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • Microchip PolarFire™ SoC FPGA with 256 MB SPI flash
  • 3U VPX (VITA 46) module
  • Compatible with multiple VITA 65 OpenVPX™ slot profiles
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • 64 GB of DDR4 ECC SDRAM in four channels
  • 256 GB of onboard NAND flash
  • One 100GBASE-KR4 Ethernet port
  • One 25G/10GBASE-KR Ethernet port
  • One 1000BASE-KX Ethernet port
  • Four x4 Gen3-capable PCI Express interfaces (can also be configured as two x8 interfaces or one x16 interface)
  • Two RS-232 and LVCMOS/LVTTL 3.3 V-configurable serial maintenance ports
  • Contact factory for PCI Express Gen4 and alternative Ethernet configuration availability
  • RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support
  • Supports SOSA Payload / Compute Intensive profiles (SLT3-PAY-1F1U1S1S1U1U4F1J-14.6.11-0 and SLT3-PAY-1F1U1S1S1U1U4F1J-14.6.13-0)
  • SOSA-aligned to AMPS profile MODA3-16.6.13-1-0-F2C-(E18-E15)(2P3F-2P3F)(E2)(G1-G2)[N]
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Linux Yocto BSP
  • Contact factory for availability of Microsoft Windows drivers and other operating systems

Specifications

Processor
  • Intel® Xeon® D-2800 series (formerly Eddy Lake) processor
  • Up to 20 Xeon®-class cores in a single, power-efficient SoC package
  • SKUs available with native extended temperature support
Memory
  • 64 GB of DDR4 ECC SDRAM in four channels
  • 256 GB of onboard NAND flash
  • 64 MB NOR boot flash
  • 64 kB EEPROM
Security and Management
  • Microchip PolarFire™ SoC FPGA with 256 MB SPI flash
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • System voltage monitor, power-on/reset control, non-volatile write-protection control
  • Trusted Platform Module (TPM)
VPX (VITA 46) P1 I/O
  • One 100GBASE-KR4 Ethernet port to P1.A
  • One 25G/10GBASE-KR Ethernet port and one 1000BASE-KX Ethernet port to P1.B
  • Ethernet ports allow up to 100 Gbps aggregate processor throughput
  • One FPGA LVDS pair
  • Two RS-232 and LVCMOS/LVTTL 3.3 V-configurable serial maintenance ports
  • One single-ended FPGA GPIO
  • One x4 PCI Express Gen3-capable interface to P1.C
  • One x4 PCI Express Gen3-capable interface to P1.D
VPX (VITA 46) P2 I/O
  • One x4 PCI Express Gen3-capable interface to P2.A
  • One x4 PCI Express Gen3-capable interface to P2.B
Software Support
  • RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support
  • UEFI firmware
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Linux Yocto BSP
  • Contact factory for availability of Microsoft Windows drivers and other operating systems
Physical Characteristics
  • 3U VPX-REDI conduction-cooled form factor
  • Supports SOSA Payload / Compute Intensive profiles (SLT3-PAY-1F1U1S1S1U1U4F1J-14.6.11-0 and SLT3-PAY-1F1U1S1S1U1U4F1J-14.6.13-0)
  • SOSA-aligned to AMPS profile MODA3-16.6.13-1-0-F2C-(E18-E15)(2P3F-2P3F)(E2)(G1-G2)[N]
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 1.0 in. pitch with Two-Level Maintenance (2LM) support
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements
  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
  • Conformal coating available as an ordering option
  • Thermal performance will vary based on CPU frequency and application
  • Contact X-ES for air-cooled development options
Power Requirements
  • SOSA Power: +12 V and +3.3 V_AUX (+5 V and +3.3 V not required)
 
 

Ordering information

There are different configurations available - please request a quote via the orange button.