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XPedite7770


Overview

Intel® Xeon D-1700 'Ice Lake-D' 3U VPX-REDI Module

The XPedite7770 from Extreme Engineering Solutions (X-ES) is a secure, high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D-1700 series of processors (formerly Ice Lake-D). The board provides 48GB DDR4, 40 gigabit Ethernet and SecureCOTs.

The XPedite7770 is an ideal choice for applications needing maximum protection for data and information, and computationally heavy processing requirements.

The XPedite7770 integrates SecureCOTS™ technology with a Microsemi® PolarFire™ FPGA for hosting custom functions to protect data from being observed or modified, and provides an excellent solution when stringent security capabilities are required.

This rugged 3U VPX SBC offers users incredible speed with a 40GBASE-KR4, up to two 10GBASE-KR, and one 10/100/1000BASE-T Ethernet ports. The XPedite7770 also supports up to 48 GB of DDR4 ECC SDRAM in three channels and up to 32 GB of onboard SLC NAND flash in addition to numerous I/O ports, including USB 2.0, PCIe, and RS-232/422/485 serial through the backplane connectors.

Additional expansion capabilities include an integrated XMC site which provides a x8 PCIe connection to the Intel® Xeon® D processor and X12d I/O mapped directly to the VPX backplane connectors.

Wind River VxWorks and X-ES Enterprise Linux (XEL) Board Support Packages (BSPs) are available.
 

Technical

  • Supports Intel® Xeon® D-1700 series (formerly Ice Lake-D) processors
  • Up to 10 Xeon®-class cores in a single, power-efficient SoC package
  • SKUs available with native extended temperature support
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • Microsemi® PolarFire™ FPGA with 128 MB SPI flash
  • 3U VPX (VITA 46) module
  • Compatible with multiple VITA 65 OpenVPX™ slot profiles
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • 48 GB of DDR4 ECC SDRAM in three channels
  • 32 GB of SLC NAND flash
  • XMC site with x8 PCIe interface and rear I/O support
  • One 40GBASE-KR4 Ethernet port
  • One 10/100/1000BASE-T Ethernet port
  • Two x4 Gen3, one x4 Gen2, and two x2 Gen2 PCIe interfaces
  • One 10GBASE-KR port (with additional port available in some board configurations)
  • Two USB 2.0 ports
  • Two RS-232/422/485 serial ports
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact Sarsen for SATA or PCIe Gen4 availability
  • Contact Sarsen for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Specifications

Processor

  • Intel® Xeon® D-1700 series (formerly Ice Lake-D) processor
  • Up to 10 Xeon®-class cores in a single, power-efficient SoC package
  • SKUs available with native extended temperature support

Memory

  • 48 GB of DDR4 ECC SDRAM in three channels
  • 32 GB of SLC NAND flash
  • 64 MB NOR boot flash
  • 64 kB EEPROM

Security and Management

  • Microsemi® PolarFire™ FPGA with 128 MB SPI flash
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • System voltage monitor, power-on/reset control, non-volatile write-protection control
  • Trusted Platform Module (TPM)

VPX (VITA 46) P0 I/O

  • Two IPMB connections to an IPMI Controller

VPX (VITA 46) P1 I/O

  • One 40GBASE-KR4 Ethernet port to P1.A
  • One x4 PCI Express Gen3-capable interface to P1.B
  • XMC P16 I/O, mapping P1w9-X12d per VITA 46.9
  • One 10GBASE-KR Ethernet port
  • One 10GBASE-KR Ethernet port (optional)

VPX (VITA 46) P2 I/O

  • One 10/100/1000BASE-T Ethernet port
  • One x4 PCI Express Gen3-capable interface
  • One x4 PCI Express Gen2-capable interface
  • Two x2 PCI Express Gen2-capable interfaces
  • Two USB 2.0 ports
  • Two RS-232/422/485 serial ports
  • Four single-ended FPGA GPIOs

Software Support

  • UEFI firmware
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

XMC Site

  • One x8 PCI Express Gen3-capable interface

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 1.0 in. pitch with Two-Level Maintenance (2LM) support

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
  • Conformal coating available as an ordering option
  • Thermal performance will vary based on CPU frequency and application
  • Contact X-ES for air-cooled development options

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Technical documents

Ordering information

There are anumber of configurations available, as well as accessories including RTMs and development platforms.

Please request a quote via the website or call the office to discuss your requirements.

Associated products