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Remote Embedded Modular Computers

myOPALE from ECRIN Systems provides a simple solution for applications that need more I/O boards than can be fitted in a standard Industrial PC based on backplane PCB.

myOPALE concept is based on four major principles:
  • Remove mechanical link between CPU and I/O cards thanks to PCI Express Over Cable interconnection;
  • Building blocks in a standard 5.25’’ form factor;
  • Re-Use of widely deployed interconnect standards from SNIA/SFF Technology Affiliate that encompass cables, connectors, form factor sizes and housing dimensions;
  • Thermal solution at building blocks level.

The CPU module incorporates all the features of an embedded computer into a small form factor 5.25’’ site with less than 8" depth.

The design is based on COM Express Type 6 and integrates Embedded Low Power SKU’s with 10 years life support. In Skylake and Kaby Lake versions, Intel Core i7 or Xeon E3-1500 CPU with Chipset platforms are selected, which directly drive 24 PCIe Gen3 lanes as their expansion bus.


Full computer in a 5.25” module
  • COM Express type 6
  • Intel® Core™ – Xeon®
  • 32 Go DDR4 ECC
  • Legacy I/O: 2x DP, 1x GbE, 4xUSB 3.0
  • Internal SATA SSD
  • Expansion I/O:
    • 24x PCIe Gen3 links
    • Up to 5 expansions (PCIe or NVMe)
    • Mini-SAS HD connectors

PCIe I/O slots in a 5.25’’ module
  • 2x PCIe x4
  • 1x PCIe x8
  • Temperature and fans monitoring from myOPALE-CPU
  • PCIe x4
  • 7x over SATA SSD throughput
  • Mini-SAS HD / U.2 cable


Please see datasheet for full specifications.


Technical documents

Ordering information

There are a wide range of configurations and options available for the myOPALE.

Ifyou would like to discuss the myOPALE concept please contact us at

ECRIN can provide a complete integrated computer with Environmental Qualification Tests passed and mandatory Certification stickers for domestic and export countries.