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XPand6000 Series


Rugged Intel® Core™ i7, Intel® Atom™, or X-ES QorIQ-Based Small Form Factor (SFF) System with XMC/PMC Support

The XPand6000 series from Extreme Engineering is based on convection-cooled and conduction-cooled, fully-ruggedised Small Form Factor (SFF) chassis, which have been designed and tested to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving, performance-enhancing, and space-efficient COTS technology.

Their compact size, availability in horizontal and vertical orientations, and use of COTS components enables the XPand6000 Series to be deployed quickly into a wide variety of airborne and ground vehicle applications.

XPand6000 Series systems can be populated with a high-performance rugged Intel® Core™ i7, Intel® Atom™, or NXP QorIQ processor-based COM Express® module. An optional Slim SATA SSD memory module (with optional integrated encryption) provides the convenience of high-capacity off-the-shelf storage, the ruggedness of solid-state non-volatile memory, and the security of 256-bit AES encryption.


  • Convection-cooled or conduction-cooled Small Form Factor (SFF) ATR chassis
  • Supports single Intel® Core™ i7, Intel® Atom™, or NXP QorIQ processor-based Rugged COM Express® module
  • Supports single conduction- cooled PMC or XMC module
  • Integration services with third-party modules available
  • Slim SATA SSD memory module (optional)
  • Integrated MIL-STD-704 28 VDC power supply
  • MIL-STD-461 E/F EMI filtering
  • Internal holdup (optional)
  • Environmentally sealed
  • D38999 connector support
  • Configurable front panel I/O connectors
  • Customisable internal carrier card for application-specific circuitry
  • Back panel power connector


Physical Characteristics – Vertical Orientation, Convection Cooling

  • Dimensions: 18cm (L) x 6cm (W) x 12.4cm (H)
  • Weighs less than 1.8kg. (fully populated)

Physical Characteristics – Horizontal Orientation, Convection Cooling

  • Dimensions: 19.6cm (L) x 12.4cm (W) x 5.3cm (H)
  • Weighs less than 1.7kg (fully populated)

Physical Characteristics – Horizontal Orientation, Conduction Cooling

  • Dimensions: 19.6cm (L) x 12.4cm (W) x 4.8cm (H)
  • Weighs less than 1.6kg (fully populated)

Configuration Options

  • Supports a single rugged Intel® Core™ i7, Intel® Atom™, or NXP QorIQ processor-based COM Express® module
  • Supports a single conduction-cooled XMC or PMC module
  • Customised carrier card solutions available for application-specific circuitry
  • Slim SATA SSD module with optional integrated encryption (optional)

Front Panel I/O Options

  • Up to two D38999 circular connectors for I/O
  • Customisable connector options
  • DVI graphics interfaces
  • USB 2.0- and 1.0-compliant interfaces
  • 10/100/1000BASE-T Gigabit Ethernet interfaces
  • RS-232/422 serial links
  • MIL-STD-1553
  • ARINC 429
  • Custom I/O via XMC or PMC modules
  • Custom I/O via carrier card

Power Supply Options

  • Integrated power supply
  • MIL-STD-704 28 VDC input voltage support (default)
  • MIL-STD-461 EMI filtering
  • Integrated internal holdup (optional)
  • Additional power supply options available


  • The chassis, power supply, and internal components are designed and tested to handle ambient temperatures down to -40°C and extreme high temperatures. However, high and low temperature performance is dependent on the capabilities of the installed COTS modules.

Technical documents

Ordering information

There are a number of different options available. Please contact Sarsen Technology for appropriate board configurations based on your application requirements.