Keeping a new deployable system on schedule is a constant challenge. Closely related is demonstrating progress to your customer. These hurdles become even higher when software application testing is impacted by problems related to hardware integration.
Components that are totally functional on an individual basis will often create system issues when they are first configured together. Signal integrity failures, power draw fluctuations, and thermal hot spots are just some of the common challenges with new hardware configurations.
You need technology vendors that work together to test complete hardware configurations and resolve system issues BEFORE delivery to your team. A truly integrated system delivers seamless connectivity between components, supporting both early application development and on-time delivery of deployable systems.
At EIZO Rugged Solutions, Atrenne and Extreme Engineering Solutions (X-ES), a shared focus on defense electronics drove a collaboration targeting consistently successful systems integration.The companies have collaborated on a technical whitepaper covering a fully integrated SWaP-C system already configured, tested, and ready for deployment.
Fully integrated and configured SWaP-C system
To help new, prospective customers easily visualize the value of an already-integrated hardware platform, the companies developed a publicly available example, with three primary components:
Atrenne’s 717-SM full ATR chassis – a rugged, AFT enclosure with a seven-slot 3U VPX backplane and an integrated power supply
EIZO’s Condor GR2-RTX5000 GPGPU processing card – based on NVIDIA Turing architecture and the NVIDIA RTX platform, this new 3U VPX module incorporates one of the most powerful CPUs currently available in the rugged market
XPedite7672 SBC from Extreme Engineering Solutions – using an Intel Xeon processor, this mature SBC, running a Linux RTOS, provides general-purpose computational performance and highly flexible I/O functionality
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