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Intel Xeon D-1500 based Rugged COTS System with Xilinx Kintex Ultrascale FPGA

The XPand6215 from Extreme Engineering is a small form factor Commercial-Off-the-Shelf (COTS) rugged system based on the Intel Xeon D-1500 family of processors and the Xilinx Kintex Ultrascale FPGA. With multiple high-speed fiber-optic interfaces on the front panel, this system delivers impressive bandwidth and performance for a wide range of signal processing applications.

The XPand6215 is comprised of one 3U VPX Intel Xeon D single board computer hosting a 10 Gigabit Ethernet XMC networking module and one 3U VPX Xilinx Kintex Ultrascale FPGA module with FireFly connectors.

This fully rugged system is designed to meet the rigorous standards of MIL-STD-810 and DO-160, while integrating the latest power-saving and performance-enhancing technology. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling and to an attached cold plate by conduction cooling. The system includes an integrated 28 VDC power supply and MIL-STD-461 EMI filtering.


  • Small Form Factor (SFF) sub-½ ATR system
  • Includes one XPedite7670 Intel® Xeon® D-1500 family processor-based 3U VPX-REDI SBC
  • Includes one hosted XPort3305 XMC with one 10 Gigabit Ethernet interface
  • Includes one XPedite2570 Xilinx Kintex® Ultrascale™ FPGA module with FireFly connectors
  • One 10GBASE-SR Ethernet port
  • Twelve 10.3125 Gb/s optical transmitter links
  • Twelve 10.3125 Gb/s optical receiver links
  • Two 10/100/1000BASE-T Gigabit Ethernet SBC ports
  • Two USB 2.0 SBC ports
  • Four RS-232/422/485 SBC ports
  • 44 FPGA LVDS pairs
  • Supports one removable memory module
  • Certificate of Volatility with read/write enable hardware discrete
  • MIL-STD-461E/F, MIL-STD-810, MIL-STD-704F qualified
  • Convection- and conduction-cooled, environmentally sealed chassis
  • Integrated 28 VDC power supply


First Slot I/O (XPedite7670 and XPort3305)

  • One SATA port to removable memory bay
  • Four RS-232/422/485 serial ports to J2
  • Two USB 2.0 ports to J2
  • Two 10/100/1000BASE-T Ethernet ports to J2
  • One 10GBASE-SR Ethernet port to J4

Second Slot I/O (XPedite2570)

  • Twelve LVDS pairs to J2
  • 32 LVDS pairs to J3
  • Eight GPIO signals to J3
  • Twelve 10.3125 Gb/s optical transmitter links to J5
  • Twelve 10.3125 Gb/s optical receiver links from J5

Slot-to-Slot Connectivity

  • One x8 PCI Express Gen3 interface

Removable Memory Bay

  • Supports one X-ES ruggedized 2.5 in. Solid-State Drive (SSD) with optional intergrated encryption
  • Up to 1 TB of SLC NAND flash

Physical Characteristics

  • Dimensions: 11.59 in. (L) x 4.87 in. (W) x 3.97 in. (H)
  • Weighs 8.75 lbs. without SSD
  • Weighs 9.11 lbs. with SSD

Power Supply

  • Integrated power supply
  • MIL-STD-704 28 VDC input voltage support
  • MIL-STD-461 EMI filtering


  • The system is designed and tested to operate in ambient temperatures down to -40°C and in extreme high temperatures. Maximum operating temperature is dependent on configuration and usage.

Technical documents

Ordering information

Please contact Sarsen Technology for more info.


Associated products